High-precision resist pattern formation is possible! Please feel free to consult us when you need assistance.
This is a manufacturing case where a precise solder resist pattern was formed on the surface of a circuit board to prevent solder adhesion and ensure mounting position accuracy. By using photosensitive solder resist and processing through a combination of screen printing and photolithography, it is possible to achieve high-precision resist pattern formation. Please feel free to consult us when needed. 【Case Overview】 ■ Material: Alumina ■ Metal Film: Ti/Pd/Au ■ Solder Resist: Thickness 18um, Line Width 0.5mm, Aperture Diameter φ0.2mm *For more details, please refer to the PDF document or feel free to contact us.
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Photolithography, essential in the ever-evolving advanced fields, is a service we have provided by combining various photolithography technologies, earning your continued support. Moving forward, we will consistently focus our energy on technological innovation, creating a bright future with you through reliable technology and rich proposal capabilities.
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