We were able to create fine patterns at the "L/S=5μm" level, which cannot be produced with conventional patterning!
This is a manufacturing case of internal collaboration between the circuit board business and the photomask business. In normal patterning, photomasks are used for patterning, but this time, we directly patterned on the substrate coated with photoresist using a drawing device that draws the photomask, exposing it to light for patterning. As a result, we were able to create fine patterns at the "L/S=5μm" level, which are impossible to achieve with normal patterning. [Case Overview] ■ L/S: Targeting 5μm → L=4.7μm/S=5.1μm ■ Film Specifications: From the base layer Cu 2μm/Ni 0.5μm/Au 1μm (Total thickness 3.5μm) *For more details, please refer to the PDF document or feel free to contact us.
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