Introducing wafer bump reflow, vacuum reflow equipment, and tabletop reflow equipment.
We would like to introduce the "Reflow Equipment" handled by Dai Nichi Shoji Co., Ltd. The "N2 Compact Size Reflow" is a product that achieves a compact size with a total length of 2.5m and 6 zones, compatible with packages such as BGA/CSP. The "φ6-8 Inch Wafer BUMP Reflow" can be used as a wet back device for bump formation after solder plating, while the "φ8-12 Inch Wafer BUMP Reflow" is suitable for reflow after ball mounting and bump printing. Additionally, we also handle "Vacuum Reflow Equipment" and "Desktop Reflow Equipment." [N2 Compact Size Reflow Features] ■ Max 350℃ (±2.5℃) ■ Compatible Size: Max 250×230mm ■ Oxygen Concentration in Oven: 50ppm and above ■ 3-phase 200V 20kW ■ Combination of hot air circulation and far infrared radiation is possible *For more details, please refer to the PDF materials or feel free to contact us.
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【Other Features (Excerpt)】 ■ φ6-8 Inch Wafer BUMP Reflow - Heating Method: Combination of hot plate and upper far-infrared heater - Integrated design of loader and unloader - Equipped with a 3-axis clean robot for handling inside the furnace ■ φ8-12 Inch Wafer BUMP Reflow - Heating Method: Combination of hot plate and upper far-infrared heater - Hot Plate: Bin standing heating adapted to wafer warping - Equipped with two 3-axis clean robots ■ Vacuum Reflow Device - Maximum φ12 inches (single chamber) - Vacuum Level: Below 10 kPa - Hot Plate & Far Infrared - Cooling: N2 nozzle (inside the furnace) / Water-cooled plate (outside the furnace) ■ Tabletop Reflow Device - Conveyor-type & Batch-type heating furnace - Supports up to 400°C and a maximum width of 340mm - Equipped with a side window for internal observation *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Company information
Dainichi Shoji Co., Ltd. was established in 1959 as an import trading company and has since provided products such as temperature sensors, plastic products, consumables, and equipment for the electronics (semiconductor and LCD) industry. In 1997, we established a plastic molding factory in Yonezawa City, Yamagata Prefecture, creating a corporate structure that combines trading and manufacturing functions. At the core of our operations is our "spirit of challenge" to quickly respond to customer requests and problem-solving, along with our commitment to manufacturing. To survive in the rapidly changing electronics industry, we continuously anticipate market demands and diligently strive to provide excellent technology and high-quality products, aiming to be a company trusted by society.