Introducing Pb-free solder paste, BGA balls, and flux.
We would like to introduce the "joining materials" handled by Dai Nichi Shoji Co., Ltd. The "Pb-free solder paste" comes in two types: water-washable and no-clean. The viscosity of the water-washable type is 160 Pa.s, while the no-clean type has a viscosity of 180 Pa.s. We offer two types of "BGA balls": low melting point and high melting point. For "flux," we have three types with different viscosities available. 【Main compositions (Pb-free solder paste)】 ■ Sn-Ag-Cu ■ Sn-Zn-Al(Bi) ■ Sn-Ag-Cu-Co ■ High melting point options are also available. *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Lineup】 ■Pb-Free Solder Paste ・Water Wash Type: PBF111-WA10.5-MK1127 ・No Clean Type: PBF111-RAA11.5-G052 ■BGA Balls ・Low Melting Point Type: L-M-P Type ・High Melting Point Type: H-M-P Type ■Flux ・FW-4025S ・FW-2800 ・FW-259 (for Flip Chip) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Company information
Dainichi Shoji Co., Ltd. was established in 1959 as an import trading company and has since provided products such as temperature sensors, plastic products, consumables, and equipment for the electronics (semiconductor and LCD) industry. In 1997, we established a plastic molding factory in Yonezawa City, Yamagata Prefecture, creating a corporate structure that combines trading and manufacturing functions. At the core of our operations is our "spirit of challenge" to quickly respond to customer requests and problem-solving, along with our commitment to manufacturing. To survive in the rapidly changing electronics industry, we continuously anticipate market demands and diligently strive to provide excellent technology and high-quality products, aiming to be a company trusted by society.