Using a silicon transmission displacement sensor, the thickness of the silicon wafer is detected non-contactly.
The "Wafercom 300" is a multifunctional measurement device compatible with bare wafers. It uses a silicon transmissive displacement sensor to detect the thickness of silicon wafers non-contactly. To minimize vibrations during measurement, high-precision air bearings made of Indian black granite are employed for the Y-axis (front-back axis) and θ-axis (rotation axis), allowing for accurate detection of wafer thickness data. Additionally, the data captured by the PC can be analyzed for global flatness, site flatness, warp, bow, and edge roll-off shape evaluation. 【Features】 ■ Compatible with bare wafers ■ Multifunctional ■ High-precision air bearings used for the Y-axis (front-back axis) and θ-axis (rotation axis) ■ Capable of accurately detecting wafer thickness data *For more details, please refer to the PDF document or feel free to contact us.
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【Specifications (Partial)】 ■Wafer Size: 300mm ■Detector: CHR-IT (CHR-E) ■Display Unit: CHR-IT ■Resolution: 0.2μm ■Detection Range: 40–3500μm ■Repeatability: 0.2μm ■Power Supply: AC110V ■Device Size: 600(W)×800(D)×1400(H)mm ■Weight: 300kg, etc. *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Doi Precision Lap Co., Ltd. is a company primarily engaged in lapping and polishing processes. As a pioneer in lapping processing, we are capable of achieving processing precision beyond that of precision grinding, thanks to our extensive experience and cutting-edge technology. We meet the processing needs of all materials, from hard materials such as carbide, ceramics, and stone to soft materials like aluminum and copper.