土井精密ラップ Product Lineup

The "Real BG300" is a multifunctional thickness measurement device used after the backgrinding process. It features high-precision X-axis (left-right axis), Y-axis (front-back axis), and θ-axis (rotation axis), allowing for the measurement of two center lines and the scribe line measurement between cut chips using the XYθ axes. Additionally, because it uses a transmissive displacement sensor, it can measure wafers with backgrinding frames and wafers with protective films. 【Features】 ■ Non-contact detection of silicon wafer thickness using a silicon transmissive displacement sensor ■ High-precision X-axis (left-right axis), Y-axis (front-back axis), and θ-axis (rotation axis) ■ Capability to measure two center lines and scribe lines between cut chips ■ Ability to measure overall thickness using a spiral trajectory on the Y-axis and θ-axis ■ Can measure wafers with backgrinding frames and wafers with protective films *For more details, please refer to the PDF document or feel free to contact us.

• Other measurement, recording and measuring instruments

The "Torin G8/G10" is a photomask substrate inspection device that measures the thickness and flatness of substrates with high precision using two opposing semiconductor lasers, while standing vertically without applying stress to the photomask substrate. The measurement range can go up to a maximum of 2100×2000mm. The main base, columns, and sliding parts are all made of Indian black granite, and air bearings are used for the measurement axes, which are critical for accurate measurements. 【Features】 ■ Two semiconductor lasers measure with high precision ■ Air bearings are used for the measurement axes, which are crucial for measurement ■ One optical probe is used exclusively for mirror-finish substrates to obtain absolute thickness and both flatness *For more details, please refer to the PDF document or feel free to contact us.

• Other inspection equipment and devices

The "Wafercom 300" is a multifunctional measurement device compatible with bare wafers. It uses a silicon transmissive displacement sensor to detect the thickness of silicon wafers non-contactly. To minimize vibrations during measurement, high-precision air bearings made of Indian black granite are employed for the Y-axis (front-back axis) and θ-axis (rotation axis), allowing for accurate detection of wafer thickness data. Additionally, the data captured by the PC can be analyzed for global flatness, site flatness, warp, bow, and edge roll-off shape evaluation. 【Features】 ■ Compatible with bare wafers ■ Multifunctional ■ High-precision air bearings used for the Y-axis (front-back axis) and θ-axis (rotation axis) ■ Capable of accurately detecting wafer thickness data *For more details, please refer to the PDF document or feel free to contact us.

• Other measurement, recording and measuring instruments

The "Microgranite Product Catalog" is a catalog of stone plate products from Doi Precision Lap Co., Ltd., a pioneer in wrapping processing. It features a wide range of stone plate products with excellent wear resistance, including a dial gauge stand that can measure right angles, flat gauges, and stone tables for precision measuring instruments. We offer a variety of stone plates in different sizes that can accommodate various digital and analog measuring instruments, along with numerous types of stands. [Contents] ■ Dial Gauge Stand ■ Spacer Blocks and Parallels ■ Flat Gauges ■ Stone Tables ■ Special Stone Plates ■ Correction of Large Stone Plates ■ Ceramic Measuring Stands, etc. *For more details, please refer to the catalog or feel free to contact us.

• Processing Contract