Introducing a measuring device capable of measuring the thickness of a surface using a spiral trajectory on the Y-axis and θ-axis.
The "Real BG300" is a multifunctional thickness measurement device used after the backgrinding process. It features high-precision X-axis (left-right axis), Y-axis (front-back axis), and θ-axis (rotation axis), allowing for the measurement of two center lines and the scribe line measurement between cut chips using the XYθ axes. Additionally, because it uses a transmissive displacement sensor, it can measure wafers with backgrinding frames and wafers with protective films. 【Features】 ■ Non-contact detection of silicon wafer thickness using a silicon transmissive displacement sensor ■ High-precision X-axis (left-right axis), Y-axis (front-back axis), and θ-axis (rotation axis) ■ Capability to measure two center lines and scribe lines between cut chips ■ Ability to measure overall thickness using a spiral trajectory on the Y-axis and θ-axis ■ Can measure wafers with backgrinding frames and wafers with protective films *For more details, please refer to the PDF document or feel free to contact us.
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【Specifications (Partial)】 ■Wafer Size: 200/300mm ■Detector: CHR-IT ■Resolution: 0.2μm ■Detection Range: 40–3500μm ■Repeatability: 0.2μm ■Power Supply: AC110V ■Dimensions of the Device: 450(W)×600(D)×1400(H)mm ■Weight: 150kg, etc. *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Doi Precision Lap Co., Ltd. is a company primarily engaged in lapping and polishing processes. As a pioneer in lapping processing, we are capable of achieving processing precision beyond that of precision grinding, thanks to our extensive experience and cutting-edge technology. We meet the processing needs of all materials, from hard materials such as carbide, ceramics, and stone to soft materials like aluminum and copper.