Introducing examples of film molding of Surprim, boasting low dielectric properties and high toughness, with Tg of 185°C and Tm of 323°C!
Here is an introduction to examples of film molding using "Saprime." "Saprime" is a thermoplastic polyimide resin that exhibits a balanced glass transition temperature (Tg 185°C) and melting point (Tm 323°C) compared to super engineering plastics such as PEEK and PEKK. It combines high strength, high heat resistance, high solvent resistance, low dielectric constant (2.66 at 10GHz), and easy moldability. It is a crystalline TPI that maintains a high glass transition temperature while lowering the melting point, making it suitable for a wide range of applications such as CFRP matrix resins, CFRP toughness modifiers, compounds, and electrical and electronic applications. 【Features】 ■ Low dielectric properties ■ Low water absorption ■ High visibility ■ High toughness ■ High Tg (185°C) ■ Crystalline film *For more details, please refer to the PDF materials or feel free to contact us.
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【Applications】 ■ 5G-related materials (UD tape, prepreg) ■ Alloy applications (PEEK, PEI, LCP) ■ Raw materials for CFRP ■ Acoustic device components ■ FPC substrates (copper-clad laminates), etc. *For more details, please refer to the PDF document or feel free to contact us.
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[Green Energy & Chemical Division] With the motto "Expanding in quantity overseas and expanding horizontally domestically," we aim to expand and strengthen our business foundation. For methanol, which is our main product, we will actively pursue overseas expansion while also developing life science product groups, enhancing MMA downstream, and expanding our catalyst business domestically.