McDermid Silver Sintered Paste Argomax for Automotive and Rail Applications
McDermid Performance Solutions Japan Co., Ltd. Argomax
It enables the manufacturing of power modules with a Tjmax of over 200℃, contributing to improved reliability of chip bonding and overall cost reduction.
The lack of suitable solder materials has previously excluded high melting point lead-free solder from serious consideration, but this is finally changing. At the same time, there is a demand for bonding materials that can maximize the capabilities of next-generation power semiconductors. Alpha Argomax sinter paste is a bonding material that can meet both of these challenging requirements. We are also focusing on the development of high thermal conductivity epoxy paste. The demand for improved reliability and cost-effective high-volume manufacturing (HVM) of die attach has never been higher. With environmentally friendly Argomax technology, it is possible to create low-pressure sintered die attachments based on highly engineered particles. Argomax creates silver bonds with very high thermal and electrical conductivity, providing high reliability and flexible bonding lines. It enables the manufacturing of SiC/GaN power modules/devices with a Tjmax of over 200°C, contributing to improved reliability of chip bonding and reduced total costs. It can also accommodate the lead-free transition for high-reliability bonds. We offer a variety of pastes, films, and preforms tailored to specific applications.
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basic information
- Improved joint reliability: More than 5 to 10 times that of solder joints - Low-pressure sintering process: Improved yield - Shortening of the joining process: Increased productivity - Environmental considerations: Lead-free and improved energy efficiency
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Applications/Examples of results
Inverters for hybrid vehicles, EVs, power transmission, railways, etc.
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