It is possible to arrange numerous fine holes of 0.01 to 0.03 mm on the surface! Applicable to custom-shaped products according to specifications.
We would like to introduce an example of the application of diffusion bonding for "mold parts gas vent blocks" that our company has conducted. This structure is designed to remove gas generated from the molten resin during resin filling into the mold. Our company is capable of arranging numerous fine holes with diameters of 0.01 to 0.03 mm on the surface. It can be applied to custom-shaped products according to specifications, including hole diameter, shape, size, and arrangement density. 【Features】 ■ High injection surface strength ■ Reduced gas venting resistance ■ Capability to arrange numerous fine holes with diameters of 0.01 to 0.03 mm on the surface ■ A structure that allows gas generated from the molten resin to be removed from the mold during resin filling *For more details, please refer to the PDF document or feel free to contact us.
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High-performance, compact, lightweight, and thermal management components provided through fine diffusion bonding technology, contributing to energy savings. Not just bonding, but also one-stop shopping for structural design, thermal fluid design, and more. We accommodate everything from prototype single items to mass production. Capable of fine three-dimensional structures, surface bonding, laminated bonding of thin plates, and bonding of dissimilar materials. Suitable for mass production of prototypes for 3D laminated structures and 3D printers. Applicable to hollow components, fine three-dimensional structures, high-pressure and high-efficiency heat exchangers with fine flow paths, high-efficiency heat sinks, reactors, mixers, and more. Extensive experience and proven results in providing solutions across various industries, including automotive, medical devices, semiconductor manufacturing equipment, food equipment, special inspection devices, power, and electrical/electronic components. For more details, please contact us.