Solid-phase diffusion bonding refers to [WELCON Corporation].

We are offering a free document that explains the features and methods of "diffusion bonding," a technology for joining metals without melting them! A must-see for manufacturing beginners!

Since our establishment, we have been working to adapt diffusion bonding technology for mass production, and we are pleased to present a detailed explanation of "diffusion bonding" from our company! The diffusion bonding we conduct is a solid-state bonding technique that joins metals without melting them, which broadens the range of feasible products and functions. For example: - High-pressure, compact, and high-performance heat exchangers (such as those for hydrogen stations) - Water-cooled heat sinks capable of uniform cooling - Vapor chambers (sheet-type heat pipes) that can diffuse localized heat input in a planar direction - Microreactors that efficiently mix minute amounts of two fluids Through the realization of fine and complex structures, we have been working on miniaturization and high performance. Please feel free to consult us, especially for any heat-related issues. This document clearly explains the principles, methods, and features of diffusion bonding! It is designed to be easy to read, even for beginners in manufacturing, using diagrams and photos. You can download the document immediately from "PDF Download." We encourage you to take a look! 【Contents】 - What is diffusion bonding? - Methods of diffusion bonding - Features of diffusion bonding

• Other electronic parts
• Heat exchanger
• air conditioning

Joining different metals is possible! We will propose prototypes suitable for the desired combination of materials and sizes.

We would like to introduce examples of dissimilar material joining that our company has conducted. Joining of stainless steel plates and copper plates, as well as aluminum and copper heat sinks, is possible, allowing for the joining of different metals. This can be applied to designs that leverage the characteristics of the materials. We can propose prototypes suitable for the desired combination of materials and sizes. 【Features】 ■ Condensed knowledge of joining and material evaluation expertise accumulated by WELCON ■ Capability to join different metals ■ Ability to propose prototypes suitable for the desired combination of materials and sizes ■ Well-suited for application to designs that utilize the characteristics of the materials *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts
• Heat exchanger
• air conditioning

Capable of manufacturing complex fine three-dimensional structures! We have a proven track record in various fields such as aerospace and chemical plants.

Solid-phase diffusion bonding is a method of directly joining materials that are to be bonded, which is significantly different from techniques such as welding or brazing. By applying heat and pressure to the materials to be joined, this technique promotes atomic movement at the bonding interface, allowing for bonding without melting the materials. This solid-state bonding expands the range of possible manufacturing methods and functionalities. Through the method of solid-phase diffusion bonding, it is possible to create fluid devices with microchannel structures and complex fine three-dimensional structures. 【Features】 ■ Lamination bonding of thin plates is possible ■ Bonding strength comparable to the base material can be achieved ■ Complex hollow components can be manufactured ■ Precise bonding with minimal deformation is possible ■ Bonding of dissimilar materials is possible *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts
• Heat exchanger
• air conditioning

Thin rib shape allows for internal cooling circuits to be placed even in narrow areas! Suitable for application in molds designed for high cycles.

We would like to introduce examples of the application of "molds with cooling circuits" that our company has implemented. It features uniform temperature control within the mold and an internal cooling circuit design tailored to the product shape. Our company can arrange internal cooling circuits even in thin rib shapes and narrow sections. This can be applied to molds designed for high cycles. 【Features】 ■ Uniform temperature control within the mold ■ Internal cooling circuit design tailored to the product shape ■ Internal cooling circuit for reducing resin cooling time ■ Capability to arrange internal cooling circuits in thin rib shapes and narrow sections *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts
• Heat exchanger
• air conditioning

It is possible to arrange numerous fine holes of 0.01 to 0.03 mm on the surface! Applicable to custom-shaped products according to specifications.

We would like to introduce an example of the application of diffusion bonding for "mold parts gas vent blocks" that our company has conducted. This structure is designed to remove gas generated from the molten resin during resin filling into the mold. Our company is capable of arranging numerous fine holes with diameters of 0.01 to 0.03 mm on the surface. It can be applied to custom-shaped products according to specifications, including hole diameter, shape, size, and arrangement density. 【Features】 ■ High injection surface strength ■ Reduced gas venting resistance ■ Capability to arrange numerous fine holes with diameters of 0.01 to 0.03 mm on the surface ■ A structure that allows gas generated from the molten resin to be removed from the mold during resin filling *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts
• Heat exchanger
• air conditioning

Smooth the walls of the resin channel (internal) to reduce flow resistance! It can be applied to injection molding molds and more.

We would like to introduce an example of the diffusion bonding application for "mold parts manifold" that our company has conducted. It has a flow path structure for injecting molten resin into the interior of the mold. It is suitable for application to injection molding molds and hot runner blocks. 【Features】 ■ Smoothens the wall surface of the resin passage (interior) to reduce flow resistance ■ Has a flow path structure for injecting molten resin into the interior of the mold ■ Well-suited for application to injection molding molds and hot runner blocks *For more details, please refer to the PDF materials or feel free to contact us.

• Other electronic parts
• Heat exchanger
• air conditioning

Features ● PICO-ITX standard ● Equipped with Intel Core Ultra 7 255U / Ultra 5 225U ● 16/32GB onboard memory ● 2.5GbE + 1GbE ● HDMI 1.4 + eDP 1.4 ● M.2 2280 M-Key x 1 (PCIe 4.0 [x4]/SATA) ● M.2 2230 E-Key x 1 (PCIe 4.0 [x1] + USB 2.0) ● USB 3.2 Gen 2 x 2 + USB 2.0 x 2 ● RS-232/422/485 x 2 ● TPM, GPIO 4-bit, SATA 6Gb/s x 1 ● SMBus/I2C (Default: SMBus) ● Intel AMT Support * This model does not include storage or OS.

Features: ● PICO-ITX standard ● Equipped with Intel Atom x7433RE/x7835RE ● DDR5 4800MHz×1 (up to 16GB) (sold separately) ● HDMI 1.4×1, eDP 1.4b/LVDS×1 ● 2.5GbE×1, GbE×1 ● Full-Size mSATA, M.2 2230 E-key x1 ● USB 3.2 Gen2[x1]×2, USB 2.0×4 ● RS-232/422/485×2, RS-232×2 ● TPM 2.0, SATA 6.0Gbps×1, GPIO 4-bit, SMBUS/I2C×1 * This is a model without an operating system.

Features: ● Equipped with Intel Processor N150 / Intel Core 3 Processor N355 ● DDR5 4800MHz SODIMM ×1 (supports up to 16GB) (sold separately) ● HDMI 1.4 ×1, eDP 1.4b / LVDS ×1 ● Intel Ethernet Controller I226 (2.5GbE RJ-45 ×1), Realtek RTL8111H (1GbE RJ-45 ×1) ● Full-size mSATA / mPCIe ×1, M.2 2230 E-Key ×1 ● USB 3.2 Gen2[x1] ×2, USB 2.0 ×4 ● RS-232/422/485 ×2, RS-232 ×2 ● TPM 2.0, SATA 6Gb/s ×1, 4-bit GPIO, SMBus / I2C ×1 ● Fan-equipped heat sink available separately PICO-ASL4-FAN01: Heat sink with fan PICO-ASL4-HSK01: Heat sink PICO-ASL4-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure) * This is a model without an operating system.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.