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  6. Example of diffusion bonding application: Mold with cooling circuit

Example of diffusion bonding application: Mold with cooling circuit

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last updated:Feb 02, 2021

WELCON 本社
WELCON 本社
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Thin rib shape allows for internal cooling circuits to be placed even in narrow areas! Suitable for application in molds designed for high cycles.

We would like to introduce examples of the application of "molds with cooling circuits" that our company has implemented. It features uniform temperature control within the mold and an internal cooling circuit design tailored to the product shape. Our company can arrange internal cooling circuits even in thin rib shapes and narrow sections. This can be applied to molds designed for high cycles. 【Features】 ■ Uniform temperature control within the mold ■ Internal cooling circuit design tailored to the product shape ■ Internal cooling circuit for reducing resin cooling time ■ Capability to arrange internal cooling circuits in thin rib shapes and narrow sections *For more details, please refer to the PDF document or feel free to contact us.

    Other electronic partsHeat exchangerair conditioning
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Example of diffusion bonding application: Mold with cooling circuit

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  • Related Link - https://www.welcon.co.jp/products/detail.html?id=9

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basic information

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Applications/Examples of results

【Purpose】 ■ Mold designed for high cycle use *For more details, please refer to the PDF document or feel free to contact us.*

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Processing "micro 3D structures"

Processing "micro 3D structures"

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Solid-phase diffusion bonding refers to [WELCON Corporation].

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Capable of manufacturing complex fine three-dimensional structures! We have a proven track record in various fields such as aerospace and chemical plants. Solid-state diffusion bonding is a method of directly bonding materials together, which is significantly different from techniques like welding or brazing. This technology promotes atomic movement at the bonding interface by heating and applying pressure to the materials being joined, allowing for bonding without melting the materials, thus expanding the range of possible manufacturing methods and functions. With the solid-state diffusion bonding method, it is possible to create fluid devices with microchannel structures and complex fine three-dimensional structures. 【Features】 ■ Lamination bonding of thin plates is possible ■ Bonding strength comparable to the base material can be achieved ■ Complex hollow components can be manufactured ■ Precise bonding with minimal deformation is possible ■ Bonding of dissimilar materials is possible *For more details, please refer to the PDF document or feel free to contact us.

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WELCON

WELCON 本社

Manufacturing and processing contract

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High-performance, compact, lightweight, and thermal management components provided through fine diffusion bonding technology, contributing to energy savings. Not just bonding, but also one-stop shopping for structural design, thermal fluid design, and more. We accommodate everything from prototype single items to mass production. Capable of fine three-dimensional structures, surface bonding, laminated bonding of thin plates, and bonding of dissimilar materials. Suitable for mass production of prototypes for 3D laminated structures and 3D printers. Applicable to hollow components, fine three-dimensional structures, high-pressure and high-efficiency heat exchangers with fine flow paths, high-efficiency heat sinks, reactors, mixers, and more. Extensive experience and proven results in providing solutions across various industries, including automotive, medical devices, semiconductor manufacturing equipment, food equipment, special inspection devices, power, and electrical/electronic components. For more details, please contact us.

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