Low price due to the absence of rare metals like Mo and W! High toughness ensured by being fully metallic.
"WEL-Therm" is a patented heat spreader made of all-metal construction, ensuring high toughness with low thermal expansion and high thermal conductivity materials. It can be applied in "semiconductor power devices," as well as "power modules such as IGBTs" and "semiconductor manufacturing equipment." It is low-cost because it does not use rare metals like Mo or W. 【Features】 ■ Patented ■ High thermal conductivity: 280W/mK ■ Coefficient of thermal expansion: 5–10ppm/K ■ High toughness ensured due to all-metal construction ■ All design parameters such as thermal conduction core diameter, arrangement density, and total thickness are freely customizable *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
【Combination Examples】 ■ Direct bonding of water-cooled heat sink ■ Direct bonding of ceramic substrate *For more details, please refer to the PDF document or feel free to contact us.
Price information
Please contact us.
Delivery Time
※Please contact us.
Applications/Examples of results
【Application Examples】 ■ Semiconductor power devices ■ Power modules such as IGBT ■ High-power LEDs, lasers ■ Semiconductor manufacturing equipment, etc. *For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
High-performance, compact, lightweight, and thermal management components provided through fine diffusion bonding technology, contributing to energy savings. Not just bonding, but also one-stop shopping for structural design, thermal fluid design, and more. We accommodate everything from prototype single items to mass production. Capable of fine three-dimensional structures, surface bonding, laminated bonding of thin plates, and bonding of dissimilar materials. Suitable for mass production of prototypes for 3D laminated structures and 3D printers. Applicable to hollow components, fine three-dimensional structures, high-pressure and high-efficiency heat exchangers with fine flow paths, high-efficiency heat sinks, reactors, mixers, and more. Extensive experience and proven results in providing solutions across various industries, including automotive, medical devices, semiconductor manufacturing equipment, food equipment, special inspection devices, power, and electrical/electronic components. For more details, please contact us.
![[Must-see for Design Developers] 'Heat Management Device' Utilizing Microchannels](https://image.mono.ipros.com/public/product/image/76d/2000646556/IPROS77510717743777683291.png?w=280&h=280)
![[Recommended Case] Automotive Parts Business](https://image.mono.ipros.com/public/product/image/4cd/2000664398/IPROS23818327266623179940.png?w=280&h=280)
