Diffusion bonding technology. Bonding strength comparable to base materials, enabling laminated bonding of thin plates.
This is an introduction to our "Diffusion Bonding Technology," which possesses top-tier technology in the country and can handle everything from basic research, idea proposals, joint development, device development, to mass production processing with in-house designed and manufactured equipment. 【Features】 - Capable of laminating thin plates - Achieves bonding strength comparable to the base material - Can manufacture hollow components in complex closed spaces - Allows for precise bonding with minimal deformation - Bonding of materials that are difficult to weld using fusion welding - Capable of bonding dissimilar metals and materials - Applicable for mass production of 3D laminated structures and 3D printers *For other functions and details, please download the catalog or contact us.
Inquire About This Product
basic information
It is a technology for joining homogeneous and heterogeneous materials, unlike casting, welding, brazing, and adhesives. It is compatible with metals, ceramics, and more. It can be applied to fine three-dimensional structures, hollow components, high-pressure and high-efficiency heat exchangers with fine flow paths, high-efficiency heat sinks, reactors, mixers, high-frequency antennas, and more. 3D printers are optimal technology for prototyping, but they also have the potential for mass production of fine 3D technologies. The method of processing thin plates and layers for lamination and integration is similar to the basics of 3D printing. It is applied in automotive, medical devices, semiconductor manufacturing equipment, food equipment, special inspection devices, communications, power, and electrical and electronic components, making it ideal for compact, high-functionality, and high-performance parts. *For other functions and details, please download the catalog or contact us.
Price information
-
Delivery Time
Applications/Examples of results
Laminated bonding of thin plates, bonding of dissimilar materials Hollow components, heat exchangers/reactors/mixers with fine flow paths Microreactors used for chemical formulation, etc.
catalog（1）
Download All Catalogs
Company information
High-performance, compact, lightweight, and thermal management components provided through fine diffusion bonding technology, contributing to energy savings. Not just bonding, but also one-stop shopping for structural design, thermal fluid design, and more. We accommodate everything from prototype single items to mass production. Capable of fine three-dimensional structures, surface bonding, laminated bonding of thin plates, and bonding of dissimilar materials. Suitable for mass production of prototypes for 3D laminated structures and 3D printers. Applicable to hollow components, fine three-dimensional structures, high-pressure and high-efficiency heat exchangers with fine flow paths, high-efficiency heat sinks, reactors, mixers, and more. Extensive experience and proven results in providing solutions across various industries, including automotive, medical devices, semiconductor manufacturing equipment, food equipment, special inspection devices, power, and electrical/electronic components. For more details, please contact us.
![[Explanatory Material] What is a Water-Cooled Microchannel Heat Sink? *Free Distribution](https://image.mono.ipros.com/public/product/image/b17/2000726009/IPROS74746189462372996053.png?w=280&h=280)
![[Technical Data] Reduced Temperature Variation! High-Performance Water-Cooled Microchannel Heat Sink](https://image.mono.ipros.com/public/product/image/e55/2000799714/IPROS17018670593636658481.PNG?w=280&h=280)
