Metal and resin bonding technology without using adhesives! TRI SYSTEM

Design can be achieved without shape constraints! Introducing a metal and resin bonding technology that firmly joins metal and resin without the use of adhesives, demonstrating excellent sealing properties.

The "TRI SYSTEM" is a technology that firmly bonds metal and resin without the use of adhesives, demonstrating excellent sealing properties. It is widely adopted by customers in the smartphone manufacturing industry for integrating metal appearance and lightweight resin during mold forming. ■ History of TRI Technology Mass Production September 2014 - Present: Application of TRI System by major Japanese manufacturers November 2015 - Present: Application of TRI System by major South Korean manufacturers September 2017 - Present: Numerous applications of TRI System by major Chinese manufacturers September 2018 - Present: Application of TRI System by Vietnamese manufacturers We have extensive mass production experience and know-how in bonding technology, enabling us to accommodate various technical requirements. When forcibly peeled apart, the bonding strength is so powerful that the structure of the resin remains intact. Additionally, since the metal and resin are uniformly bonded, it is possible to create a high airtight state. The ability to bond even complex shapes allows for design without constraints. 【Features】 ■ Strong bonding strength ■ High sealing performance ■ Adaptable to complex shapes ■ Excellent reliability ■ High applicability for mass production *For more details, please refer to the PDF document or feel free to contact us.

Contract manufacturing