It realizes strong and uniform adhesion by expressing a bonding mechanism (chemical bonding) on the metal surface.
The "TRI System" is a bonding technology that integrates metal and resin based on a new concept. By using bonding film formation technology for metals and insert molding technology, it achieves the integration of metal and resin without the use of adhesives. The bonding film formed by surface treatment of the metal allows for a strong bond between the metal and resin, boasting a bonding strength that is incomparable to the intermolecular forces of adhesives. Additionally, since the metal and resin are uniformly bonded, it is possible to create a high airtight condition. It can bond even simple shapes, allowing for design without constraints on shape. 【Features】 ■ Strong bonding strength ■ High sealing performance ■ No need for complex shapes *For more details, please download the PDF or feel free to contact us.
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【Joinable Metals and Resins】 ■Metals ・Copper-based, Aluminum ■Resins ・PPS, PBT, etc. *For more details, please download the PDF or feel free to contact us.
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Our company is a manufacturer specializing in surface treatment processing, primarily focusing on plating. We are engaged in various surface treatment processes known as plating, functional thin film processing, and the development of new surface treatment technologies as our main business, excelling in surface treatment processing for semiconductors, electrical and electronic components, and housing parts. Through years of collaborative research and development with academia and government, we possess unique functional thin film technology. Additionally, we actively pursue patents for our functional thin film processing technology and expand our technology both domestically and internationally. Please feel free to contact us if you have any inquiries.
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