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  6. What is solid-state diffusion bonding?

What is solid-state diffusion bonding?

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last updated:Feb 02, 2021

WELCON 本社
WELCON 本社
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Capable of manufacturing complex fine three-dimensional structures! We have a proven track record in various fields such as aerospace and chemical plants.

Solid-phase diffusion bonding is a method of directly joining materials that are to be bonded, which is significantly different from techniques such as welding or brazing. By applying heat and pressure to the materials to be joined, this technique promotes atomic movement at the bonding interface, allowing for bonding without melting the materials. This solid-state bonding expands the range of possible manufacturing methods and functionalities. Through the method of solid-phase diffusion bonding, it is possible to create fluid devices with microchannel structures and complex fine three-dimensional structures. 【Features】 ■ Lamination bonding of thin plates is possible ■ Bonding strength comparable to the base material can be achieved ■ Complex hollow components can be manufactured ■ Precise bonding with minimal deformation is possible ■ Bonding of dissimilar materials is possible *For more details, please refer to the PDF document or feel free to contact us.

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What is solid-state diffusion bonding?

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  • Related Link - https://www.welcon.co.jp/core/diffusion-bonding.ht…

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【Process of Area Increase in Diffusion Bonding】 ■ Before Heating ■ Process of Deformation of the Joint Surface's Irregularities ■ Process of Grain Boundary Migration and Void Disappearance ■ Process of Void Disappearance Due to Volume Diffusion *For more details, please refer to the PDF document or feel free to contact us.

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【Example of Related Achievements (Excerpt)】 ■ Aerospace ■ Chemical Plants ■ Printing Machines ■ Fuel Cells ■ Electronic Devices ■ Semiconductor Manufacturing Equipment ■ Information Communication and Antennas, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Processing "micro 3D structures"

Processing "micro 3D structures"

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Heat spreader low thermal expansion high thermal conductivity material "WEL-Therm"

Heat spreader low thermal expansion high thermal conductivity material "WEL-Therm"

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Microchannel Heat Sink 'M4040/M2020'

Microchannel Heat Sink 'M4040/M2020'

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Vapor Chamber "WEL-HeatRibbon"

Vapor Chamber "WEL-HeatRibbon"

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WEL-Cool Heat Exchanger PF0.5

WEL-Cool Heat Exchanger PF0.5

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WEL-Cool Heat Exchanger CF0.5

WEL-Cool Heat Exchanger CF0.5

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Microchannel Heat Exchanger "WEL-Cool"

Microchannel Heat Exchanger "WEL-Cool"

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Solid-phase diffusion bonding refers to [WELCON Corporation].

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Capable of manufacturing complex fine three-dimensional structures! We have a proven track record in various fields such as aerospace and chemical plants. Solid-state diffusion bonding is a method of directly bonding materials together, which is significantly different from techniques like welding or brazing. This technology promotes atomic movement at the bonding interface by heating and applying pressure to the materials being joined, allowing for bonding without melting the materials, thus expanding the range of possible manufacturing methods and functions. With the solid-state diffusion bonding method, it is possible to create fluid devices with microchannel structures and complex fine three-dimensional structures. 【Features】 ■ Lamination bonding of thin plates is possible ■ Bonding strength comparable to the base material can be achieved ■ Complex hollow components can be manufactured ■ Precise bonding with minimal deformation is possible ■ Bonding of dissimilar materials is possible *For more details, please refer to the PDF document or feel free to contact us.

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WELCON

WELCON 本社

Manufacturing and processing contract

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High-performance, compact, lightweight, and thermal management components provided through fine diffusion bonding technology, contributing to energy savings. Not just bonding, but also one-stop shopping for structural design, thermal fluid design, and more. We accommodate everything from prototype single items to mass production. Capable of fine three-dimensional structures, surface bonding, laminated bonding of thin plates, and bonding of dissimilar materials. Suitable for mass production of prototypes for 3D laminated structures and 3D printers. Applicable to hollow components, fine three-dimensional structures, high-pressure and high-efficiency heat exchangers with fine flow paths, high-efficiency heat sinks, reactors, mixers, and more. Extensive experience and proven results in providing solutions across various industries, including automotive, medical devices, semiconductor manufacturing equipment, food equipment, special inspection devices, power, and electrical/electronic components. For more details, please contact us.

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