Achieving plating accuracy of ±0.1mm with our drum plating structure!
We offer the 'REEL to REEL Connector Plating Equipment' that achieves a plating accuracy of ±1.0mm through the adoption of special liquid level control. With a product pass line of FL +1000mm for ease of operation and a compact design, it supports energy saving and reduced wastewater. Additionally, stable transport can be achieved with special guide rollers. 【Equipment Configuration】 ■ Basic Model: MRC-02 to 03 ■ Number of Lines: 2 to 3 lines ■ Line Speed: 1.0 to 25.0m/min ■ Target Products: Connectors and materials ■ Target Materials: Cu alloys, SUS, etc. *For more details, please download the PDF or feel free to contact us.
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【Basic Plating Specifications】 ■ Full Ni + Partial Au + Partial Solder ■ Full Cu + Full Sn + Reflow, etc. *For more details, please download the PDF or feel free to contact us.
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Our company designs and manufactures surface treatment equipment for connectors and lead frames, as well as various devices for semiconductor wafers. Based on the philosophy of supporting small-batch production and fine part plating, we supply original equipment tailored to our customers' needs with the concepts of "ease of use," "easy product switching," and "easy maintenance." In particular, we have a pioneering track record in plating equipment for semiconductor wafers, with over 100 units installed worldwide, continuously providing plating equipment that meets our customers' needs.