三友セミコンエンジニアリング Product Lineup

We offer a "semiconductor rack-type semi-automatic plating device" that contributes to productivity improvement through parallel processing of two plates. Due to the presence of a buffer area for the fixtures, production can proceed without affecting user operation procedures. Additionally, we can provide equipment tailored to customer processes. Please feel free to contact us with your requests. 【Device Overview】 ■ Target Size: 6 inches to 12 inches ■ Target Plating: Composite such as Ni/Cu/Sn ■ Device Type: Semi-Automatic (Includes equipment for loading and unloading products onto the fixture) *For more details, please download the PDF or feel free to contact us.

• Plating Equipment

We handle a "small carrier-type plating device for substrates" designed to function as a comprehensive system, including tanks, carriers, and circulation methods. The entire device is compact and considers workability. Additionally, the use of AC servo motors for the carrier ensures stable operation. 【Device Overview】 ■ Basic Style: MCS-02P ■ Basic Mechanism: Cantilever Carrier Type ■ Travel Speed: 20m/min ■ Lifting Speed: 7m/min ■ Plating Specifications: According to your specifications ■ Material: Printed Circuit Board *For more details, please download the PDF or feel free to contact us.

• Plating Equipment

Our company offers a compact design of the 'Short-Length Ag Spot Plating Device' with a convenient pass line of FL+1000mm. It adopts a special overflow method suitable for thin materials and multiple pins. Additionally, the loading section can switch between vacuum and chuck types. 【Device Overview】 ■ Basic Model: MMS-02 (03・04) ■ Number of Bars: 4 bars ■ Line Speed: 0.5m to 2.0m/min (Normal: 1.6m/min) ■ Pass Line: FL+1000mm ■ Cycle Time: 17.5 seconds/cycle (Machine: 8sec + Plating) and more *For more details, please download the PDF or feel free to contact us.

• Plating Equipment

Our company offers the 'REEL to REEL Ag Spot Plating Equipment' with automatic control using a touch panel and sequencer. By adopting an image processing system, we can reproduce plating area accuracy of ±0.07mm without pilot pins. Additionally, stable power supply and transport can be ensured with special power supply rollers and guide rollers. 【Equipment Overview】 ■ Number of Rows: 2 to 3 rows ■ Line Speed: Standard 3.6 to 4.0m/min ■ Target Products: Lead Frame, LED Frame, and others ■ Basic Plating Specifications: Cu + Ni + Ag Spot ■ Target Materials: 42 Alloy, Cu Alloy *For more details, please download the PDF or feel free to contact us.

• Plating Equipment

We offer the 'REEL to REEL Connector Plating Equipment' that achieves a plating accuracy of ±1.0mm through the adoption of special liquid level control. With a product pass line of FL +1000mm for ease of operation and a compact design, it supports energy saving and reduced wastewater. Additionally, stable transport can be achieved with special guide rollers. 【Equipment Configuration】 ■ Basic Model: MRC-02 to 03 ■ Number of Lines: 2 to 3 lines ■ Line Speed: 1.0 to 25.0m/min ■ Target Products: Connectors and materials ■ Target Materials: Cu alloys, SUS, etc. *For more details, please download the PDF or feel free to contact us.

• Plating Equipment