Communication between the computer and the sequencer allows for easy operation and data management!
We handle a "small carrier-type plating device for substrates" designed to function as a comprehensive system, including tanks, carriers, and circulation methods. The entire device is compact and considers workability. Additionally, the use of AC servo motors for the carrier ensures stable operation. 【Device Overview】 ■ Basic Style: MCS-02P ■ Basic Mechanism: Cantilever Carrier Type ■ Travel Speed: 20m/min ■ Lifting Speed: 7m/min ■ Plating Specifications: According to your specifications ■ Material: Printed Circuit Board *For more details, please download the PDF or feel free to contact us.
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Our company designs and manufactures surface treatment equipment for connectors and lead frames, as well as various devices for semiconductor wafers. Based on the philosophy of supporting small-batch production and fine part plating, we supply original equipment tailored to our customers' needs with the concepts of "ease of use," "easy product switching," and "easy maintenance." In particular, we have a pioneering track record in plating equipment for semiconductor wafers, with over 100 units installed worldwide, continuously providing plating equipment that meets our customers' needs.