Introducing next-generation bonding technology that chemically bonds different materials together without the use of adhesives!
"Nano-level bonding" is a key technology that chemically bonds dissimilar materials together. This technology, which is gaining significant attention domestically, is combined with innovative plating techniques to create the next generation of plating and three-dimensional wiring technology called "MARBS," which achieves substrate-less designs. Furthermore, plating is possible on materials that cannot be plated using sputtering or vapor deposition methods. 【Features of MARBS】 ■ Next-generation plating and three-dimensional wiring technology ■ Achieves substrate-less designs ■ Enables plating on materials that cannot be plated using sputtering or vapor deposition methods *For more details, please refer to the related link page or feel free to contact us.
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