For the Cu plating/Cu seed structure, it etches the Cu seed layer with minimal damage to the Cu plating wiring and bumps.
The features of this product are as follows: - There is less thinning of the Cu plating. - There is less surface roughness of the Cu. - It can be applied to various seed layers (from electroless copper plating to sputtered copper). - It supports various methods such as dip, spray, and spin. Keywords: wet etching, copper, plating, seed layer, selective semi-additive method.
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We offer a wide range of standard samples, including pesticide standard samples and environmental hormone-related substance standard samples, totaling around three thousand types, to various research institutes and survey organizations nationwide. In addition to reagents, we are also engaged in research and development of chemicals for the electronics industry, and in recent years, we have established a collaborative development system with users to propose new functions and conduct performance evaluations, supporting the development of the electronics industry.
