Equivalent peel strength to conventional eutectic solder. No-clean high-performance flux-containing solder.
There is no corrosion from the flux residue, and cleaning of the substrate is not necessary. The residue is non-hygroscopic and has excellent electrical insulation properties. It has good durability of activity and exhibits excellent wettability. It uses a special active rosin based on organic amines (non-chlorinated). Complies with JIS-AA grade and MIL-RMA standards.
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basic information
【Common】 Composition: Sn 96.5%, Ag 3%, Cu 0.5% Flux content: 3.5% Melting point: 217℃ 【Wire diameter/Weight】 SWF-03: 0.3mm/100g SWF-06: 0.6mm/10g SWF-08: 0.8mm/14g SWF-10: 1mm/26g
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Applications/Examples of results
Copper, for precision substrates made of copper and copper alloys.
Company information
Since our founding in 1948, we have been manufacturing and selling tools for professionals in the electrical and electronic equipment industry. We have contributed to the development of industry through tools and jigs that enhance productivity in manufacturing sites, as well as tools that utilize new materials to support research in semiconductors and biotechnology. As we move forward in the context of global warming and the arrival of a super-aged society, the role of "tools" as "preparation" for "roads" will become increasingly important. We would like to propose tools that can further develop the wonderful relationship between "humans" and "tools."
