Lead-free high-performance solder with flux for precision copper and copper alloy substrates.
High-performance, no-clean solder with flux for precision substrates. It has no corrosive residues, eliminating the need for cleaning the substrate. The residues are non-hygroscopic and have excellent electrical insulation properties. It exhibits good activity sustainability and excellent wettability. Uses special organic amine-based active rosin (non-chlorinated). Complies with JIS-AA grade and MIL-RMA standards.
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basic information
【Common】 Composition: Sn 60%, Pb 40% Melting point: 183–190℃ Flux content: 1.7% Water solution resistance: 6×10⁻Ω cm Insulation resistance value: 2×10⁻ (normal state), 2×10⁻ (after humidification)Ω 【Wire diameter/Weight】 SWS-06: 0.6mm/15g SWS-08: 0.8mm/20g SWS-10: 1mm/35g SWS-12: 1.2mm/40g SWS-56: 0.6mm/500g SWS-58: 0.8mm/500g SWS-60: 1mm/500g SWS-62: 1.2mm/500g SWS-76: 0.6mm/1000g SWS-78: 0.8mm/1000g SWS-80: 1mm/1000g SWS-82: 1.2mm/1000g
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Applications/Examples of results
Copper, for precision substrates made of copper and copper alloys.
Company information
Since our founding in 1948, we have been manufacturing and selling tools for professionals in the electrical and electronic equipment industry. We have contributed to the development of industry through tools and jigs that enhance productivity in manufacturing sites, as well as tools that utilize new materials to support research in semiconductors and biotechnology. As we move forward in the context of global warming and the arrival of a super-aged society, the role of "tools" as "preparation" for "roads" will become increasingly important. We would like to propose tools that can further develop the wonderful relationship between "humans" and "tools."
