Essential for acquiring knowledge in substrate design! Clearly presented with diagrams and tables, including ceramic types and thickness, product flatness (warpage), and pattern dimension accuracy!
This document introduces the AMB substrate design rules. It clearly presents information on ceramic types and thicknesses, layer composition, work sizes, product sizes, and prohibited areas for patterns on the product's outer perimeter, along with diagrams and tables. We encourage you to read it. 【Contents (excerpt)】 ■ Ceramic types and thicknesses ■ Copper thickness ■ Layer composition ■ Work sizes and product sizes ■ Product outer dimension tolerances ■ Prohibited areas for patterns on the product's outer perimeter *For more details, please refer to the PDF document or feel free to contact us.
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【Other Publication Contents (Excerpt)】 ■Minimum Line/Space ■Pattern Side (Hem) Dimensions ■Front and Back Pattern Misalignment ■Product Flatness (Warp Amount) ■Pattern Dimension Accuracy ■Total Thickness Tolerance ■Surface Treatment ■Surface Roughness *For more details, please refer to the PDF materials or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Located in Chino City, Nagano Prefecture, we are a printed circuit board manufacturer that offers services from design to implementation on circuit boards, from prototype development products to mass production. We have extensive experience in thermal management boards and can propose the most suitable materials and structures for our customers' applications. Additionally, in recent years, we have also been accommodating thick copper boards for high current applications with various substrates.