アイン 本社工場
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アイン Company Overview
A wide variety of heat management wiring boards available!
Located in Chino City, Nagano Prefecture, we are a printed circuit board manufacturer that offers services from design to implementation on circuit boards, from prototype development products to mass production. We have extensive experience in thermal management boards and can propose the most suitable materials and structures for our customers' applications. Additionally, in recent years, we have also been accommodating thick copper boards for high current applications with various substrates.
Business Activities
Design, manufacturing, and EMS of printed circuit boards (1) Rigid printed circuit boards (2) High-frequency printed circuit boards (Teflon, ceramics, PPE, etc.) (3) Ceramic printed circuit boards (DPC, AMB) (4) Thermal management printed circuit boards such as metal base (5) Formation of UV high-reflective film on the surface of the printed circuit board (6) Processing of clad materials using selective etching solutions (7) Surface treatment using vacuum technologies such as plasma and sputtering (8) EMS
Recommended information
ceramics substrate(DPC substrate)
High heat resistance and high strength! Ceramic wiring board using DPC plating method.
The "DPC substrate" is a ceramic wiring substrate that offers higher heat resistance and strength than conventional thick-film printed circuit boards. It is a substrate using the DPC (Direct Plated Copper) plating method, compatible with various materials such as alumina (Al₂O₃), aluminum nitride (AlN), silicon nitride (Si₃N₄), and glass. 【Specifications】 ■ Base material: Compatible with various materials including alumina, aluminum nitride, silicon nitride, and glass ■ Conductor thickness: 10 to 100 μm *For more details, please refer to the PDF document or feel free to contact us.
Thin film circuit board (under development)
Thin-film process enables the realization of fine and high-precision ceramic wiring boards.
This is a ceramic wiring substrate capable of forming fine patterns through a thin film process. 【Features】 By combining our plating technology, it is also possible to create circuits with different thicknesses on the front and back. Example: Front Cu/Ni/Au, Back Ti/Pt/Au *For more details, please refer to the PDF document or feel free to contact us.
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Detailed information
| Company name | アイン 本社工場 |
|---|---|
| number of employees | 107 |
| Contact address | postalcode 391-0213 Nagano/ Chino-shi/ Toyohira 374-2 (Fukuzawa Industrial Park)View on map TEL：0266-72-7003 FAX：0266-73-5031 |
| Business Locations | Click here for the list |
| Industry | Electronic Components and Semiconductors |
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