Utilizing the Marangoni effect! Developed for the drying of thin wafers in power device manufacturing.
When using our conventional product "IMD III" for drying thin wafers, a problem arose where adjacent wafers came into contact when separating the wafer from the carrier, leading to inadequate drying. The "IMD IIID" holds the upper part of the wafer immediately after it emerges from the pure water surface, following the start of the drying process with pure water withdrawal. By subsequently separating the wafer from the carrier, it prevents contact between wafers, providing drying capabilities equivalent to carrierless drying. 【Features】 ■ Watermark-free drying ■ Marangoni drying using pure water withdrawal method ■ Drying of thin wafers, which is difficult with conventional drying methods ■ Reduction in IPA consumption (10-20cc/1 batch) ■ Capable of drying 3” to 8” wafers *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Lineup】 ■150IMD IIID-ASC1DMHP ■150IMD IIID-AWC2DMHP *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Applications】 ■Drying in the manufacturing of Si power devices ■Drying in the manufacturing of SiC power devices ■Drying in the manufacturing of LSI devices ■Drying in the manufacturing of Si wafers ■Drying in the manufacturing of SiC wafers *For more details, please refer to the PDF document or feel free to contact us.
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Our company is composed of three business divisions, manufacturing hard disk burnishing machines with approximately 100% global market share, test handlers for semiconductors, appearance inspection equipment, automation equipment for various industries, top-class share high-efficiency solar cell wafer texturing equipment, various precision cleaning devices, drying equipment, and more. Please feel free to contact us if you have any inquiries.