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  3. ワイエイシイメカトロニクス つくば事業所 PV事業部
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ワイエイシイメカトロニクス つくば事業所 PV事業部

addressIbaraki/Tsukuba-shi/Hanabatake 3-13-13
phone029-846-3950
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last updated:Nov 19, 2020
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IPA Mist Direct Replacement Drying Device 'IMD IIID'

Utilizing the Marangoni effect! Developed for the drying of thin wafers in power device manufacturing.

When using our conventional product "IMD III" for drying thin wafers, a problem arose where adjacent wafers came into contact when separating the wafer from the carrier, leading to inadequate drying. The "IMD IIID" holds the upper part of the wafer immediately after it emerges from the pure water surface, following the start of the drying process with pure water withdrawal. By subsequently separating the wafer from the carrier, it prevents contact between wafers, providing drying capabilities equivalent to carrierless drying. 【Features】 ■ Watermark-free drying ■ Marangoni drying using pure water withdrawal method ■ Drying of thin wafers, which is difficult with conventional drying methods ■ Reduction in IPA consumption (10-20cc/1 batch) ■ Capable of drying 3” to 8” wafers *For more details, please refer to the PDF document or feel free to contact us.

  • Drying Equipment

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Pure Water Heating Device "HDW III"

A pure water heating device suitable for hot deionized water cleaning of silicon substrates and hot deionized water lift drying!

The "HDW III" is a device used for the cleaning of ultra-pure water in semiconductor manufacturing processes, solar cell manufacturing processes, and glass substrates in liquid crystal manufacturing processes. It non-contactly heats the water using a carbon heater within a quartz glass container. It features stable temperature control within ±1° through PID control and can achieve a temperature rise from startup to operating temperature in under 120 seconds. Additionally, it accommodates a wide range of flow rates and temperatures, allowing for temperature adjustments in response to flow rate changes. 【Features】 ■ Clean heating ■ High efficiency and energy-saving ■ High-performance temperature adjustment ■ A comprehensive lineup tailored to the usage flow rate *For more details, please download the PDF or contact us.

  • Heating device

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High-Temperature Clean Gas Heating Device "Jet II"

It is possible to generate clean superheated steam at up to 900℃!

The "Jet II" is a high-temperature clean gas heating device that generates clean heating gas by using high-purity quartz glass for the gas-liquid contact section, thereby minimizing the leaching of metal ions, TOC, and other contaminants to the utmost limit. This device can also generate various clean gases and clean superheated steam at temperatures up to 900°C. 【Features】 ■ The heating element (SiC) can achieve rapid ultra-high temperature heating up to 1000°C using an infrared lamp concentrator. ■ The gas-liquid contact section is entirely made of quartz glass, allowing for gas heating without leaching of impurities. ■ It is possible to vaporize acidic or alkaline solutions that would corrode metals. * Depends on the type and concentration of the chemical solution. ■ Capable of generating heating gas at a maximum temperature of 900°C. ■ Can reheat steam at 100°C to superheated steam at a maximum of 900°C. * For more details, please download the PDF or contact us.

  • Heating device

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IPA mist direct replacement drying device

IPA mist direct replacement drying device utilizing IPA vaporless and Marangoni convection.

We propose the "Watermarkless Drying Device," developed through our many years of experience in the design and manufacturing of IPA vapor drying equipment, along with the know-how we have cultivated through numerous case studies, utilizing IPA vapor-less drying and Marangoni convection for continuous improvement. By directly replacing the IPA after cleaning the Si wafer, we can achieve a surface free of water droplets without exposing it to the atmosphere, allowing for a direct replacement of the Si wafer surface from "pure water to IPA." 【Features】 ■ Watermarkless drying ■ Suppression of particle re-adhesion ■ IPA vapor-less ■ Reduction in IPA consumption ■ Capable of drying a wide range of materials ■ Customized design to meet customer needs *For more details, please download the PDF or contact us.

  • Drying Equipment

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IPA vapor condensation replacement drying device

IPA vapor condensation replacement drying device suitable for the drying of ultra-thin Si device manufacturing.

We propose our IPA vapor drying device, which has been developed with a focus on preventing the occurrence of watermarks on substrate surfaces, a common issue in various semiconductor and electronic device manufacturing processes. Additionally, this device serves as a rational cleaning and drying apparatus that not only dries optical and uneven parts requiring clean drying but also performs a high-purity finishing wash using distilled IPA simultaneously. 【Features】 ■ One of the largest market shares in the world ■ Safe design ■ Watermark-free drying ■ Clean drying ■ Capable of drying a wide range of materials, etc. *For more details, please download the PDF or contact us.

  • Drying Equipment

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