We will introduce "Via processing," "Cavity processing," and "EMC removal processing."
Here are some examples of applications for "sandblasting" processing. In "via processing," we can perform small-diameter via and high-aspect processing, while in "cavity processing," we can shorten processing time. Additionally, in "EMC removal processing," processing efficiency is improved, allowing for time reduction and cost savings. If it's sandblasting processing, please leave it to us. 【Processing Application Examples】 ■ Via Processing ■ Cavity Processing ■ EMC Removal Processing *For more details, please refer to the PDF document or feel free to contact us.
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【Dedicated Blast Device for Printed Circuit Board Processing - Machine Specifications】 ■ Pneuma Blaster "HC-8BAR-NH-822M-R150" ■ Target board size: 340mm x 515mm, with fixture up to 400mm x 580mm ■ Cycle time: 7.5 minutes/board, with 2 rows of work ■ Main body width: 2400mm ■ Main body depth: 2000mm ■ Main body height: 1955mm ■ Maximum height: 2830mm (up to the top of the gun's horizontal movement motor) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Asahi Denki Zai Co., Ltd. is a rare and valuable electronics trading company that focuses on "manufacturing equipment for electronic circuits." In recent years, we have received many invitations from companies in the rapidly developing "NIES countries," contributing to technological advancement. We will combine all our organizational capabilities to provide our customers with suitable "planning, performance, cost, and maintenance," so please feel free to consult us when needed.