A highly skilled team with experience is at your service! We can also consider non-standard specifications.
Ice Moss delivers world-class DSP (Double Sided Polished) solutions based on over 20 years of experience. Our highly skilled team, with extensive experience in design and manufacturing, provides DSP solutions tailored to meet your needs. 【Features】 ■ Ice Moss's DSP wafers are excellent substrates that allow pattern transfer on both sides. ■ Ice Moss can control thickness and surface roughness with expertise and experience in products and processes, leading to an ideal bonding process. ■ We can also consider non-standard specifications. *For more details, please refer to the PDF document or feel free to contact us.
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【Final Market】 ■Telecommunications ■Healthcare ■Automotive ■Home Appliances ■Security *For more details, please refer to the PDF document or feel free to contact us.
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【Applications】 ■ DSP solutions in the MEMS/MST field ■ Microfluidics/Flow sensors ■ RF MEMS ■ Optoelectronics *For more details, please refer to the PDF document or feel free to contact us.
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Our company was established in 2004 as a best-in-class supplier providing high-voltage power MOSFETs and MEMS technology processes that deliver high performance for power supplies, advanced technology base wafers, SOI (silicon on insulator), and bonded silicon substrates at a high cost-effectiveness. (Headquartered in the U.S., with manufacturing facilities in the U.K. and R&D in Tokyo) We have developed and realized high-voltage super junction MOSFETs with innovative deep trench etching MEMS structures through a simple and low-cost process. Please feel free to contact us if you have any inquiries.