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  6. Graphene heat dissipation material "Graphene Flower SP"

Graphene heat dissipation material "Graphene Flower SP"

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last updated:Feb 21, 2023

進和 戦略営業推進室
進和 戦略営業推進室
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This is a high-performance heat sink that achieves both high thermal conductivity and thickness. The direction of heat conduction can be controlled either in the plane direction or in the vertical (thickness) direction.

This is a heat dissipation plate made from high-oriented graphite, which has been graphitized using a unique molding technology with graphene as the raw material, and can be cut to any thickness. It has a thermal conductivity of over twice that of copper (700-1000 W/m·K), is lightweight with a bulk density of one-fourth that of copper (2.2 g/cm³), and excels in sound wave permeability. You can choose between the XY type with high thermal conductivity in the plane direction and the XZ type with high thermal conductivity in the vertical (thickness) direction. Its machinability is the same as that of general graphite, and it can be processed using grinding wheels and milling machines. It is also possible to process and deliver it in the specified shape within the designated size. Prototypes can be made from a single piece. For details, we will propose the optimal heat dissipation material after consultation. Applications: Heat transfer in the thickness direction for high-output devices such as inverters (thickness of 2 mm or more), heat dissipation plates for thermal diffusion requiring a thickness of 1 mm or more, and other heat dissipation plates requiring thickness for smartphones, laptops, tablets, etc.

    Other polymer materials
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Graphene heat dissipation material "Graphene Flower SP"

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Basic Specifications of Graphene Flower SP Bulk Density: 2.2g/cm³ Composition: 100% Carbon Orientation: Anisotropic Thermal Conductivity: SP7 700W/m·K SP9 900W/m·K Size: XY Type 100x70mm Thickness 0.3mm–100mm XZ Type 100x100mm Thickness 1.5mm–70mm Heat Resistance Temperature: 3000°C in Inert Gas Place of Production: Japan (Kobe)

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Purpose: Heat transfer in the thickness direction of high-power devices such as inverters (thickness of 2 mm or more), heat dissipation plates that require a thickness of 1 mm or more, etc. Additionally, heat spreaders for smartphones, laptops, and tablets, as well as heat dissipation plates that require specific thicknesses. *The size and thickness of the plates, as well as processing precision, will be determined after consultation.

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  • GF4W2-DS-300x300.gif

    Graphene flower dispersion liquid

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Graphene heat dissipation material "Graphene Flower SP"

Graphene heat dissipation material "Graphene Flower SP"

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進和

進和 戦略営業推進室

Industrial Machinery

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Our company is a development and proposal-oriented trading firm with "metal joining" as the core of our business, actively involved in manufacturing. We offer contract services and maintenance using joining technologies such as brazing, build-up welding, and thermal spraying, as well as sales of equipment and materials, introduction of industrial machinery, and construction of FA systems. Furthermore, we engage in the development and manufacturing of electronics-related devices, achieving a diverse and flexible business style that spans a wide range of fields. We will continue to demonstrate our uniqueness through the pursuit of manufacturing and are committed to contributing to the development of the industrial sector as our mission, striving for business expansion.

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