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  6. It's also okay to use it twisted! "Flexible substrate compatible with high-speed transmission connectors."

It's also okay to use it twisted! "Flexible substrate compatible with high-speed transmission connectors."

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last updated:Oct 14, 2024

山下マテリアル
山下マテリアル
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Supports high-speed transmission up to 15GHz! We have combined the high-speed transmission connectors from Irisoh Electronics with our flexible substrates.

The "Flexible substrate compatible with high-speed transmission connectors" combines the high-speed transmission connectors from Irisoh Electronics, [IMSA-11600S-30Y900 and IMSA-11501S-30Y900], with our YFC series (LVDS type microstrip line) RFM. By integrating them, it supports high-speed transmission up to 15GHz. 【Features】 ■ The LVDS-compatible FPC has been slotted. ■ It is easy to bend and can also be twisted for use. *For more details, please refer to the PDF document or feel free to contact us.

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2021-05-10_09h49_09.png

It's also okay to use it twisted! "Flexible substrate compatible with high-speed transmission connectors."

2021-05-10_09h49_09.png
2021-05-10_09h49_09.png 2021-05-10_09h49_19.png 2021-05-10_09h49_23.png 2021-05-10_09h49_27.png
  • Related Link - https://www.yamashita-net.co.jp/
  • Special site - Product/service details - https://pr.mono.ipros.com/yamashita-net/product/

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basic information

【Layer Structure】 ■Differential 100Ω±10% ■Microstrip Line ■Total Length 130mm *For more details, please refer to the PDF document or feel free to contact us.

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High-speed transmission connector compatible FPC

High-speed transmission connector compatible FPC

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Notice of Participation in MWE 2023 (Microwave Workshops and Exhibition) by Yamashita Material from November 29 to December 1, 2023.

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We will be exhibiting at MWE 2023 (Microwave Workshops and Exhibition) held from November 29 to December 1, 2023. On that day, we will showcase flexible printed circuits (FPC) focusing on low-loss FPC and high-current FPC "BigElec." We invite you to take this opportunity to see our products and experience our innovative technology. Advance registration is required for entry. Please register using the following URL: https://f-vr.jp/mw/jizen23/

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山下マテリアル

山下マテリアル

Electronic Components and Semiconductors

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We are committed to contributing to daily life, society, and industry through value creation driven by materials, technology, and speed (short delivery times) as our motto. FPC can be extremely thin and flexible, allowing it to be used in even the smallest spaces. Therefore, it is utilized in various fields such as smartphones, communication devices, medical equipment, eco-cars like EVs/HVs/FCVs, autonomous driving systems, and VR/AR devices. One of our features is our ability to respond to short delivery times, with the shortest possible delivery being available from the "one-and-a-half-day course." Recently, we developed the "BigElec" FPC, which supports high current. It can be used as a substitute for busbars and harnesses, and we have also obtained a patent for it. We are dedicated to listening sincerely to the needs of our customers and society to develop and create new products, while prioritizing safety and consistently delivering high-quality products. This integrated approach strengthens our foundation for growth and maximizes corporate value. We are building a solid foothold in the ever-changing global market and are striving for continuous growth and development. Please feel free to consult with us.

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