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  6. Specification for filling holes! "Ultra-small diameter through hole."

Specification for filling holes! "Ultra-small diameter through hole."

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last updated:Apr 17, 2026

山下マテリアル
山下マテリアル
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It is possible to form through holes with a diameter of 25μm or less on double-sided FPC. Additionally, it is also possible to form holes with a minimum diameter of 20μm and a minimum pad diameter of 95μm.

"Ultra-small diameter through holes" are formed with a diameter of φ20μm on both sides of the FPC through laser processing. It is possible to create holes with a minimum diameter of 20μm and a minimum pad diameter of 95μm. By using through-hole plating to fill the holes and arranging the through holes on the pattern, it enables narrower pitch and contributes to the miniaturization of the product. 【Features】 ■ Formation of through holes with a diameter of Φ25μm or less on both sides of the FPC is possible. ■ The holes are filled with 15μm through-hole plating specifications. *For more details, please refer to the PDF document or feel free to contact us.

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Specification for filling holes! "Ultra-small diameter through hole."

2021-05-10_10h29_04.png
2021-05-10_10h29_04.png 2021-05-10_10h28_58.png 2021-05-10_10h29_07.png
  • Related Link - https://www.yamashita-net.co.jp/
  • Special site - Product/service details - https://pr.mono.ipros.com/yamashita-net/product/

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【Standard Specifications】 ■Base Polyimide: 50um ■Conductor Thickness: 12um ■Hole Diameter (Top Side): φ 20um ■Hole Diameter (Bottom Side): φ 15um ■Land Diameter: 95um *For more details, please refer to the PDF document or feel free to contact us.

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Ultra-small diameter through hole

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山下マテリアル

山下マテリアル

Electronic Components and Semiconductors

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We are committed to contributing to daily life, society, and industry through value creation driven by materials, technology, and speed (short delivery times) as our motto. FPC can be extremely thin and flexible, allowing it to be used in even the smallest spaces. Therefore, it is utilized in various fields such as smartphones, communication devices, medical equipment, eco-cars like EVs/HVs/FCVs, autonomous driving systems, and VR/AR devices. One of our features is our ability to respond to short delivery times, with the shortest possible delivery being available from the "one-and-a-half-day course." Recently, we developed the "BigElec" FPC, which supports high current. It can be used as a substitute for busbars and harnesses, and we have also obtained a patent for it. We are dedicated to listening sincerely to the needs of our customers and society to develop and create new products, while prioritizing safety and consistently delivering high-quality products. This integrated approach strengthens our foundation for growth and maximizes corporate value. We are building a solid foothold in the ever-changing global market and are striving for continuous growth and development. Please feel free to consult with us.

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