Introducing a break device compatible with 6-inch wafers! By exchanging the blade and table, it can accommodate wafers from 2 inches to 4 inches.
By using double-arm transport, the loading time for wafers is reduced. Additionally, improved visibility decreases matching errors during image recognition. 【Features】 ■ Standard support for 6-inch wafers ■ Equipped with break recognition function ■ Increased throughput due to enhanced ring transport function ■ Improved operability due to enhanced image recognition function *For more details, please refer to the PDF document or feel free to contact us.*
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basic information
【Options】 ■Top Light System - Provides effective illumination from above for wafers that are difficult to see with illumination from below. ■Electromagnetic Hammer Unit - Supports breaking for wafers that are difficult to break with normal break operations alone.
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Applications/Examples of results
High hardness materials, chip separation of compound semiconductors (sapphire, GaAs, GaN, InP, Si, SiC, ceramics, LTCC, glass)
Detailed information
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High hardness materials, chip separation of compound semiconductors (sapphire, GaAs, GaN, InP, Si, SiC, ceramics, LTCC, glass)
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Company information
Kumasan Medics Co., Ltd. is composed of three divisions: the Semiconductor Technology Division, the MPSD Business Division, and the Sales Division. In our daily actions and activities, each employee stands in the customer's perspective, perceiving potential needs, striving for transformation towards better solutions, and we believe that the products and services that result from this will evolve into something that is beneficial to our customers, and we will continue to take on this challenge.
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