くまさんメディクス Product Lineup

By optimizing the heating and cooling mechanisms and employing a high-rigidity machine design, we achieve a uniform temperature distribution and stable load distribution, preventing the occurrence of wax thickness variations that can negatively impact precision. 【Features】 ■ Pressure, temperature, and time conditions can be set according to the characteristics of the wafer ■ Damage to the device is minimized ■ Achieves uniform temperature distribution and stable load distribution ■ Prevents the occurrence of wax thickness variations that affect precision ■ Compatible with 12-inch wafers *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines

This is a semi-automatic scriber device compatible with 4-inch wafers, where the processing axis, feed axis, and camera axis are each independent. Unlike spring-based systems, it is not affected by the depth of the cut, allowing for a constant load, and the air suspension effect significantly reduces tool jumping. Additionally, to minimize vibrations on the drive side, it is equipped with a linear servo motor, enabling more precise scribing. 【Features】 ■ High rigidity design and high throughput ■ Auto-alignment function ■ Tool pressure control via air ■ Equipped with a linear servo motor *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines

This is a semi-automatic scribing device compatible with 4-inch wafers, where the processing axis, feed axis, and camera axis are each independent. Unlike spring-based systems, it is not affected by the depth of the cut, allowing for a constant load, and the air suspension effect significantly reduces tool jumping. Additionally, to minimize vibrations on the drive side, it is equipped with a linear servo motor, enabling more precise scribing. 【Features】 ■ High rigidity design and high throughput ■ Auto-alignment function ■ Tool pressure control via air ■ Equipped with a linear servo motor *For more details, please refer to the PDF materials or feel free to contact us.

• Other processing machines

This is a semi-automatic scriber device compatible with 4-inch wafers, where the processing axis, feed axis, and camera axis are each independent. Unlike spring-based systems, it is not affected by the depth of the cut, allowing for a constant load, and the air suspension effect significantly reduces tool jumping. Additionally, to minimize vibrations on the drive side, it is equipped with a linear servo motor, enabling more precise scribing. 【Features】 ■ High rigidity design and high throughput ■ Auto-alignment function ■ Tool pressure control via air ■ Equipped with a linear servo motor * For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines

This is a semi-automatic scribing device compatible with 4-inch wafers, featuring independent processing axis, feed axis, and camera axis. Unlike spring-based systems, it is not affected by the depth of the cut, allowing for a constant load, and the air suspension effect significantly reduces tool jumping. Additionally, to minimize vibrations on the drive side, it is equipped with a linear servo motor, enabling more precise scribing. 【Features】 ■ High rigidity design and high throughput ■ Auto-alignment function ■ Tool pressure control via air ■ Equipped with linear servo motor *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines

By exchanging the break blade and work table, it is possible to accommodate wafers from 2 inches to 4 inches. The double-arm transport reduces wafer loading time. Additionally, improved visibility decreases matching errors during image recognition. 【Features】 - Standard support for 6-inch wafers - Equipped with break recognition function - Improved throughput due to enhanced ring transport function - Improved operability due to enhanced image recognition function *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines

By using double-arm transport, the loading time for wafers is reduced. Additionally, improved visibility decreases matching errors during image recognition. 【Features】 ■ Standard support for 6-inch wafers ■ Equipped with break recognition function ■ Increased throughput due to enhanced ring transport function ■ Improved operability due to enhanced image recognition function *For more details, please refer to the PDF document or feel free to contact us.*

• Other processing machines

By using double-arm transport, we shorten the loading time of wafers. Additionally, by improving visibility, we reduce matching errors during image recognition. 【Features】 ■ Standard support for 6-inch wafers ■ Equipped with break recognition function ■ Improved throughput due to enhanced ring transport function ■ Improved operability due to enhanced image recognition function *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines

The "TEC-1228AL" is a fully automatic break device compatible with 6-inch wafers. By exchanging the break blade and work table, it can also accommodate wafers from 2 inches to 4 inches. The double-arm transport reduces the loading time of the wafers. Additionally, improved visibility decreases matching errors during image recognition. 【Features】 ■ Standard support for 6-inch wafers ■ Equipped with break recognition function ■ Increased throughput due to improved ring transport function ■ Enhanced operability due to improved image recognition function *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductors
• Other semiconductor manufacturing equipment

The "TEC-1018AR" is a fully automatic break device compatible with 4-inch wafers. It comes with an essential auto-alignment function for fully automatic break devices. It performs all processes automatically, from wafer loading with image recognition to unloading after processing. By detecting whether a break has occurred or not, it has achieved a reduction in the occurrence of double chips. 【Features】 ■ Fully automatic operation with image recognition ■ Auto wafer alignment function ■ Break recognition function included ■ Small chip compatibility due to high rigidity design ■ Loader, unloader, and system ■ Custom break blade available *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

The "TEC-2005RM" is a semi-automatic scriber device compatible with 4-inch wafers, featuring independent processing axes, feed axes, and camera axes. Unlike spring-based systems, it is not affected by the cutting depth, allowing for a constant load, and the air suspension effect significantly reduces tool jumping. Additionally, to reduce vibrations on the drive side, it is equipped with a linear servo motor, enabling more precise scribing. 【Features】 ■ High rigidity design and high throughput ■ Auto-alignment function ■ Tool pressurization via air control ■ Equipped with linear servo motor *For more details, please refer to the PDF materials or feel free to contact us.

• Other semiconductors
• Other semiconductor manufacturing equipment

The "TEC-1006ZR" is a wafer wax application device compatible with 4-inch wafers. It achieves stabilization of the flatness of wafer attachment. It can accommodate multiple wafers. It can attach a maximum of 10 pieces for 2-inch wafers, 5 pieces for 3-inch wafers, and 3 pieces for 4-inch wafers. 【Features】 - Achieves stabilization of the flatness of wafer attachment (our record: 2.5um) - Capable of handling multiple wafers - Supports a variety of recipes including heating, wax application, pressing, and cooling - Achieves high throughput through optimization of conditions (our record: 2-inch x 8 wafers = within 15 minutes) *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Other semiconductor manufacturing equipment

The "TEC-1001MB" is a dedicated device for wafer wax application that achieves high-quality grinding and polishing processes. It allows for the setting of pressure, temperature, and time conditions according to the characteristics of the wafer, minimizing damage to the device. By optimizing the heating and cooling mechanisms and employing a highly rigid structural design, it ensures uniform temperature distribution and stable load distribution, preventing the occurrence of wax thickness variation that can affect precision. 【Features】 ■ Allows for setting pressure, temperature, and time conditions according to wafer characteristics ■ Minimizes damage to the device ■ Achieves uniform temperature distribution and stable load distribution ■ Prevents the occurrence of wax thickness variation that affects precision ■ Compatible with 12-inch wafers *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Other semiconductor manufacturing equipment
• Other semiconductors

The "Lead Frame Counter" is a device for measuring the number of L/F (Lead Frame), resin substrates, and IC trays. It is effective in reducing counting time and minimizing counting errors. The operation is simple, with just a start button and a count clear function. Additionally, it can handle L/F thickness as thin as 0.1mm and the minimum overlap gap of 0.3mm. It is not affected by the material or plating treatment of the L/F and is compatible with resin substrates. 【Features】 ■ Easy operation ■ Free settings ■ Compact and lightweight ■ Low price *For more details, please download the PDF or contact us.

• Other measurement, recording and measuring instruments