12-inch compatible wafer wax application device 'TEC-1001MB'

We can accommodate various workpieces, including compound semiconductor wafers!

The "TEC-1001MB" is a dedicated device for wafer wax application that achieves high-quality grinding and polishing processes. It allows for the setting of pressure, temperature, and time conditions according to the characteristics of the wafer, minimizing damage to the device. By optimizing the heating and cooling mechanisms and employing a highly rigid structural design, it ensures uniform temperature distribution and stable load distribution, preventing the occurrence of wax thickness variation that can affect precision. 【Features】 ■ Allows for setting pressure, temperature, and time conditions according to wafer characteristics ■ Minimizes damage to the device ■ Achieves uniform temperature distribution and stable load distribution ■ Prevents the occurrence of wax thickness variation that affects precision ■ Compatible with 12-inch wafers *For more details, please refer to the PDF document or feel free to contact us.

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