Full Auto Brake Device "TEC-1018AR"

Fully automatic break device that can be widely used for chip separation, package separation, and more!

The "TEC-1018AR" is a fully automatic break device compatible with 4-inch wafers. It comes with an essential auto-alignment function for fully automatic break devices. It performs all processes automatically, from wafer loading with image recognition to unloading after processing. By detecting whether a break has occurred or not, it has achieved a reduction in the occurrence of double chips. 【Features】 ■ Fully automatic operation with image recognition ■ Auto wafer alignment function ■ Break recognition function included ■ Small chip compatibility due to high rigidity design ■ Loader, unloader, and system ■ Custom break blade available *For more details, please refer to the PDF document or feel free to contact us.

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