Introducing a break device compatible with 6-inch wafers! It is a fully automatic break device.
By exchanging the break blade and work table, it is possible to accommodate wafers from 2 inches to 4 inches. The double-arm transport reduces wafer loading time. Additionally, improved visibility decreases matching errors during image recognition. 【Features】 - Standard support for 6-inch wafers - Equipped with break recognition function - Improved throughput due to enhanced ring transport function - Improved operability due to enhanced image recognition function *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Options】 ■Top Light System - Provides effective illumination from above for wafers that are difficult to see with illumination from below. ■Electromagnetic Hammer Unit - Supports breaking for wafers that are difficult to break with normal breaking operations alone. *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
Compounds such as sapphire, GaAs, GaN, InP, Si, SiC, ceramics, LTCC, and glass, as well as high-hardness materials, can also be processed.
Detailed information
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Compound semiconductors such as sapphire, GaAs, GaN, InP, Si, SiC, ceramics, LTCC, and glass, as well as high-hardness materials, can also be processed.
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Company information
Kumasan Medics Co., Ltd. is composed of three divisions: the Semiconductor Technology Division, the MPSD Business Division, and the Sales Division. In our daily actions and activities, each employee stands in the customer's perspective, perceiving potential needs, striving for transformation towards better solutions, and we believe that the products and services that result from this will evolve into something that is beneficial to our customers, and we will continue to take on this challenge.