We offer a wide range of proposals from patterning of power devices and LED substrates (such as bonding, metallization, and resist) to plating for subsequent processes of substrates.
In recent years, the development of insulating and heat-dissipating substrates has become active in response to the market expansion of power devices and other products. Our company is advancing application development by combining our long-standing expertise in "plating" and "screen printing" film formation technologies. We are providing samples with the premise of mass production, so please feel free to consult with us.
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basic information
[Printing Specifications Overview] Position Accuracy (Automatic Correction): 30μ Effective Printing Dimensions: 250 × 400mm Printable Board Thickness (t) - Roll Material: up to 0.2mm - Sheet: 4mm Curing Method: UV Curing/Thermal Curing (Drying) Automatic Inspection Device [Plating Specifications (Electroless Plating)] - Electroless Copper Plating (Cu: Thin Film/Thick Film) - Electroless Silver Plating (Ag) - Electroless Tin Plating (Sn) - Electroless Nickel Plating (Ni-p/Electroless Ni-B)
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Applications/Examples of results
- Power device substrate - High-output LED substrate - Shield case, etc.
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Company information
The slogan is "Challenge the Impossible." We are a technology development-oriented company that broadly develops unique surface treatment technologies to meet the special needs required for essential low-voltage components (related to electricity, electronics, and semiconductors), high-voltage components (such as high-voltage connectors), and insulating components. Additionally, we have established a support system that incorporates functional surface treatments, which we have cultivated since our founding, as our core technology, along with processes such as pressing, heat treatment, painting, and assembly. We will continue to deliver consistent Yuden-sha brand technologies and products to the world. *We support online business meetings.