Silver migration and galvanic corrosion prevention for bonding aluminum and copper electrodes.
Conductive adhesive that does not use conventional silver fillers For high-temperature and high-humidity applications concerned about silver migration For conductive adhesion to aluminum where galvanic corrosion is a concern For electrode adhesion of FPC (Flexible Printed Circuit)
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basic information
431: Copper filler conductive epoxy adhesive N20E: Nickel filler conductive epoxy adhesive 107-40: Nickel filler conductive silicone adhesive
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Applications/Examples of results
Grounding of stray currents in electric motors Adhesion of RF shielding
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Rikei Corporation was established in 1957 and is a solution vendor in the IT and electronics industry, celebrating its 65th anniversary. We propose a variety of solutions centered around cutting-edge technologies and advanced products in the fields of system solutions, network solutions, and electronic components and devices, tailored as the optimal "step-ahead solution" to meet our customers' needs.


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