Fine cutting processing SUS304 Contract processing Stainless fine processing
Realization of fine cutting processing.
【Material and Processing】 SUS304 Thickness: 0.05mm Cutting Width: 0.1mm Cut-out Processing 【Features】 This product has undergone fine shape processing of thin film materials using ultra-short pulse laser. It is expected to be processed for miniaturization of parts and for incorporation into stacked products.
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◆Precision machining of difficult-to-cut materials and complex shapes ◆Automotive parts, medical device parts, electronic components, semiconductor parts ◆Prototype and development projects Leave it to us. We handle everything from processing to equipment setup. We have launched our satellite site "Ultra Short Pulse Laser.com." It is compatible with smartphone layouts, aiming to create a more user-friendly browsing experience. We appreciate your continued support. Satellite site: https://tyotannpulselaser.com/ ■ Hikari Kikai Seisakusho Co., Ltd. Address: 8-1 Ichinokata Nakano, Tsu City, Mie Prefecture 514-0112 Tel: 059-227-5511 Fax: 059-227-5514 E-mail: info@hikarikikai.co.jp Website: https://www.hikarikikai.co.jp/ Satellite site: https://tyotannpulselaser.com/ ■ HIKARI LASER LAB. Address: Room 511, Higashi-Katsushika Techno Plaza, 5-4-6 Kashiwanoha, Kashiwa City, Chiba Prefecture 277-0882 Tel: 0471-70-4866 Fax: 0471-70-4866
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【Industry and Application】 Automotive-related industry Medical devices and medical components industry Semiconductors and electronic components
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At "HIKARI LASER LAB.", we offer services for precision processing using ultra-short pulse lasers, including "contract processing," "development agency," and "marking." Precision processing and surface modification/internal marking using picosecond and femtosecond lasers are utilized in various industrial equipment across sectors such as the medical industry, automotive industry, and semiconductor industry. Recently, there has been a demand for surface modification not only for shape processing like fine hole drilling, cutting, trimming, and groove processing but also for enhancing functionalities such as water repellency, release properties, friction reduction, and improved sliding properties. Additionally, there is a demand for marking inside glass from the medical industry. Laser processing is possible on a wide range of materials, including transparent materials like glass and diamonds, difficult-to-cut materials like titanium, and resins, CFRP, ceramics, and polyimides. Regarding surface modification, we have received requests to improve the release properties of molds. We will continue to "challenge" ourselves in precision processing and surface modification using ultra-short pulse lasers to meet our customers' needs!
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