High-speed dicing of difficult-to-process materials such as SiC and glass - TLS-Dicing

High-speed cutting of extremely difficult-to-process materials like "SiC and glass" is possible! A technology essential for the spread of EVs!

With the spread of EVs (electric vehicles) and the increase in power consumption due to network connections between electronic devices, there is a growing demand for semiconductors that can handle higher output and higher current. "Power semiconductors" using next-generation semiconductor materials such as SiC are gaining attention. However, the processing of hard and brittle SiC requires advanced technology. Traditional mechanical and laser cutting methods face many issues, such as slow processing speeds, chipping, a wide cutting width leading to reduced production volume, and the inability to cut electrode surfaces. Our laser micro-processing technology, "TLS-Dicing," utilizes thermal stress from temperature differences between heating and cooling, enabling high-speed cutting even for difficult-to-process materials like SiC and glass. It can be utilized in various industries that handle hard-to-cut semiconductor materials. *Actual processing photos and data for difficult-to-cut materials and hard brittle materials can be downloaded and viewed from the link below.

Processing Contract