Marking on aluminum thin films using ultrashort pulse lasers.
【Microfabrication Company Logo Mark Ultra-Short Pulse Laser Thin Film Material】 【Material】 Aluminum foil Thickness: 11μm 【Industry and Application】 Automotive industry Medical devices and medical parts industry Semiconductors and electronic components 【Dimensions】 Processing size: 3mm x 3mm square range 【Processing】 Ultra-short pulse laser processing 【Features】 This product features a company logo mark laser processed onto aluminum thin film material. Due to its thickness of 11μm, it is less likely to be affected by heat, allowing for clean processing.
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◆Microprocessing of difficult-to-cut materials and complex shapes ◆Automotive parts, medical device parts, electronic components, semiconductor parts ◆Prototyping and development projects We support everything from processing to equipment setup. Since July 2020, we have launched our satellite site "Ultra Short Pulse Laser.com." We are aiming for a site that is easier for users to browse, compatible with smartphone layouts. We appreciate your continued support. Satellite site: https://tyotannpulselaser.com/ ■ Hikari Kikai Seisakusho Co., Ltd. Address: 8-1 Ishinda Nakano, Tsu City, Mie Prefecture 514-0112 Tel: 059-227-5511 Fax: 059-227-5514 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/ Satellite site: https://tyotannpulselaser.com/ ■ HIKARI LASER LAB. Address: Room 511, Higashi-Kashiwa Techno Plaza, 5-4-6 Kashiwa-no-ha, Kashiwa City, Chiba Prefecture 277-0882 Tel: 0471-70-4866 Fax: 0471-70-4866
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At "HIKARI LASER LAB.", we offer services for precision processing using ultra-short pulse lasers, including "contract processing," "development agency," and "marking." Precision processing and surface modification/internal marking using picosecond and femtosecond lasers are utilized in various industrial equipment across sectors such as the medical industry, automotive industry, and semiconductor industry. Recently, there has been a demand for surface modification not only for shape processing like fine hole drilling, cutting, trimming, and groove processing but also for enhancing functionalities such as water repellency, release properties, friction reduction, and improved sliding properties. Additionally, there is a demand for marking inside glass from the medical industry. Laser processing is possible on a wide range of materials, including transparent materials like glass and diamonds, difficult-to-cut materials like titanium, and resins, CFRP, ceramics, and polyimides. Regarding surface modification, we have received requests to improve the release properties of molds. We will continue to "challenge" ourselves in precision processing and surface modification using ultra-short pulse lasers to meet our customers' needs!
