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  6. Laser microprocessing: Chip breaker (groove) processing

Laser microprocessing: Chip breaker (groove) processing

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last updated:Sep 18, 2019

光機械製作所 HIKARI LASER LAB.
光機械製作所 HIKARI LASER LAB.
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Micro chip breaker (groove) processing for PCD (polycrystalline diamond sintered body)

The tip of the PCD cutting tool was grooved using an ultra-short pulse laser. This improves the discharge of "cutting chips" generated during cutting and maintains a good cutting condition. It is also possible to process materials such as carbide and CBN (cubic boron nitride). Chip breaker (groove) processing Material: PCD (polycrystalline diamond sintered body) Breaker width: 600 μm

    Processing ContractbyteOther cutting tools
md1x3_0_n13.jpg

Laser microprocessing: Chip breaker (groove) processing

md1x3_0_n13.jpg
md1x3_0_n13.jpg

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The tip of the PCD cutting tool was processed with an ultra-short pulse laser to create grooves. This improves the discharge of "cutting chips" generated during cutting and maintains a good cutting condition. It is also possible to process materials such as carbide and CBN (cubic boron nitride). Chip breaker (groove) processing Material: PCD (polycrystalline diamond sintered body) Breaker width: 600μm

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Chip breaker (groove) processing Material: PCD (polycrystalline diamond sintered body) Breaker width: 600 μm

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Characteristics and History of Ultrashort Pulse Lasers

Characteristics and History of Ultrashort Pulse Lasers

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Internal Modification of Glass by Laser Micromachining and Principles of Marking

Internal Modification of Glass by Laser Micromachining and Principles of Marking

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Laser Micromachining Thin Film Processing Case Studies Thickness Below 50μ

Laser Micromachining Thin Film Processing Case Studies Thickness Below 50μ

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Laser microfabrication: Through holes in glass.

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Company information

光機械製作所

光機械製作所 HIKARI LASER LAB.

Manufacturing and processing contract

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At "HIKARI LASER LAB.", we offer services for precision processing using ultra-short pulse lasers, including "contract processing," "development agency," and "marking." Precision processing and surface modification/internal marking using picosecond and femtosecond lasers are utilized in various industrial equipment across sectors such as the medical industry, automotive industry, and semiconductor industry. Recently, there has been a demand for surface modification not only for shape processing like fine hole drilling, cutting, trimming, and groove processing but also for enhancing functionalities such as water repellency, release properties, friction reduction, and improved sliding properties. Additionally, there is a demand for marking inside glass from the medical industry. Laser processing is possible on a wide range of materials, including transparent materials like glass and diamonds, difficult-to-cut materials like titanium, and resins, CFRP, ceramics, and polyimides. Regarding surface modification, we have received requests to improve the release properties of molds. We will continue to "challenge" ourselves in precision processing and surface modification using ultra-short pulse lasers to meet our customers' needs!

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