Laser microfabrication: Ultra-fine long holes were trimmed into copper.
【Laser Micromachining Micro Trimming Processing Copper Cu Micro Holes】 【Material】 Copper (Cu) 【Material Dimensions】 Thickness 0.1mm (100μm) 【Processing】 Ultrashort Pulse Laser Processing 【Features】 This product achieves micro trimming processing on 0.1mm thick copper. The residual allowance between the long holes is 50μm, which is very fine. Copper is a material that is easily affected by heat, but by selecting the wavelength of the ultrashort pulse laser, it is possible to process fine shapes with reduced thermal effects. Physical damage and thermal effects are significantly minimized, resulting in fine processing with minimal burrs. ◆ Fine processing of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device parts, electronic components, semiconductor parts ◆ Prototype and development projects Leave it to us. We handle everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 〒277-0882 Chiba Prefecture, Kashiwa City, Kashiwa-no-ha 5-4-6, Room 511, Tokatsu Techno Plaza Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hik
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【Laser Micromachining Micro Trimming Processing Copper Cu Micro Holes】 【Material】 Copper (Cu) 【Dimensions】 Thickness 0.1mm (100μm) 【Processing】 Ultrashort Pulse Laser Processing 【Features】 This product achieves micro trimming processing on 0.1mm thick copper. The remaining allowance between the long holes is 50μm, which is very fine. Copper is a material that is easily affected by heat, but by selecting the wavelength of the ultrashort pulse laser, it is possible to process fine shapes with reduced thermal effects. Physical damage and thermal impact are significantly minimized, resulting in fine processing with minimal burrs. ◆ Micromachining of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device components, electronic components, semiconductor parts ◆ Prototype and development projects We take care of everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 〒277-0882 Chiba Prefecture, Kashiwa City, Kashiwa-no-ha 5-4-6, Room 511, Tokatsu Techno Plaza Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hik
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【Laser Micromachining Micro Trimming Processing Copper Cu Micro Holes】 【Material】 Copper (Cu) 【Dimensions】 Thickness 0.1mm (100μm) 【Processing】 Ultrashort Pulse Laser Processing 【Features】 This product achieves micro trimming processing on 0.1mm thick copper. The remaining allowance between the long holes is 50μm, which is very fine. Copper is a material that is easily affected by heat, but by selecting the wavelength of the ultrashort pulse laser, it is possible to process fine shapes while reducing thermal effects. Due to the significant reduction of physical damage and thermal effects, we have achieved fine processing with minimal burrs. ◆ Fine processing of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device parts, electronic components, semiconductor parts ◆ Prototype and development projects Leave it to us. We handle everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 〒277-0882 Chiba Prefecture, Kashiwa City, Kashiwa-no-ha 5-4-6, Room 511, Tokatsu Techno Plaza Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hik
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At "HIKARI LASER LAB.", we offer services for precision processing using ultra-short pulse lasers, including "contract processing," "development agency," and "marking." Precision processing and surface modification/internal marking using picosecond and femtosecond lasers are utilized in various industrial equipment across sectors such as the medical industry, automotive industry, and semiconductor industry. Recently, there has been a demand for surface modification not only for shape processing like fine hole drilling, cutting, trimming, and groove processing but also for enhancing functionalities such as water repellency, release properties, friction reduction, and improved sliding properties. Additionally, there is a demand for marking inside glass from the medical industry. Laser processing is possible on a wide range of materials, including transparent materials like glass and diamonds, difficult-to-cut materials like titanium, and resins, CFRP, ceramics, and polyimides. Regarding surface modification, we have received requests to improve the release properties of molds. We will continue to "challenge" ourselves in precision processing and surface modification using ultra-short pulse lasers to meet our customers' needs!
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