3D power packaging for low power DC/DC converters

Achieve high power density with 3D power packaging! Up to 99% efficiency, no heat sink required!

The "low power DC/DC converter" is increasingly required to provide higher cost performance despite the growing demands for improved performance and high power density. Module manufacturers often respond by utilizing a minimal number of components and employing transformers and inductors that are hand-soldered onto the PCB. RECOM's long-term goal was to develop a thin package that can be implemented and soldered like other thin SMT components. However, to realize the advantages of converter modules over discrete designs, it is necessary to keep the footprint small and effectively utilize the Z-direction by leveraging 3D power packages. **Features** - Output currents of 0.5A, 1A, 1.5A, 2A, 3A, and 6A - 4 - 65VDC input with adjustable output up to 28VDC - Up to 99% efficiency, no heat sink required, six-sided shielding for low EMI - Wide operating temperature range from -40°C to +107°C at full load - Fully protected with SCP, OCP, OTP, and UVLO *For more details, please refer to the PDF document or feel free to contact us.*

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