It provides a foundation for critical thinking and scientific development for scholars and experts.
The University of Southampton (UK), known for its prominent research activities, influences science and human life across various fields and provides a foundation for critical thinking and scientific advancement for scholars and professionals. Finetech's versatile flip chip die bonder, FINEPLACER, contributes to optoelectronics research at one of the UK's polytechnic universities. This case study introduces "top-notch equipment for top-notch research." *For more details about the case study, please refer to the PDF document. Feel free to contact us for more information.*
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*You can view the detailed information about the case in the PDF document. For more information, please feel free to contact us.*
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Fine Tech is a manufacturer of die bonders and flip chip bonders, headquartered in Berlin, Germany, specializing in the development, design, and manufacturing of high-precision die bonding equipment, consistently providing cutting-edge assembly technology. We strive to support all our customers, ranging from venture companies to multinational corporations, universities, and government agencies, across various fields including electronics, electronic devices, optical components, aerospace, medical, and military. Fine Tech Japan Co., Ltd. was established on August 1, 2014, as a base for sales and application support related to die bonding for Japanese customers, and we are actively working to provide the latest assembly technology to our customers in Japan.