We are stacking delicate membrane chips with a post-bonding accuracy of less than 1μm!
The Microelectronics Research Institute in Stuttgart conducts business-oriented research in fields such as silicon technology, application-specific integrated circuits (ASICs), nanostructures, and image sensor technology, and provides specialized training. In new applications, it has become a critical requirement to stack membrane chips of a few centimeters in size with very high precision. After all steps of placement and stacking are completed, the post-bonding accuracy for the entire process must be less than 1μm. This case study introduces a "die bonder compatible with stacking implementation of membrane chips with a post-bonding accuracy of 1μm." *For more detailed information about the case study, please refer to the PDF materials. Feel free to contact us for more details.*
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*You can view the detailed information about the case from the PDF document. For more information, please feel free to contact us.*
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*You can view the detailed information of the case from the PDF document. For more information, please feel free to contact us.*
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Company information
Fine Tech is a manufacturer of die bonders and flip chip bonders, headquartered in Berlin, Germany, specializing in the development, design, and manufacturing of high-precision die bonding equipment, consistently providing cutting-edge assembly technology. We strive to support all our customers, ranging from venture companies to multinational corporations, universities, and government agencies, across various fields including electronics, electronic devices, optical components, aerospace, medical, and military. Fine Tech Japan Co., Ltd. was established on August 1, 2014, as a base for sales and application support related to die bonding for Japanese customers, and we are actively working to provide the latest assembly technology to our customers in Japan.