Ultra-high precision bonders that achieve both submicron accuracy and mass production capability.
This machine is a flip chip bonder that is optimal for mass production of optical devices that require both sub-micron level ultra-high precision assembly and high production, as well as devices that require high precision mounting. It also supports face-up mounting as an option.
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basic information
Main Features ■ Compatible with microchips (0.25 mm and above) (Option: 0.15 mm and above) ■ Capable of ultra-high precision mounting of less than ±1 μm (3σ) Achieves stable mounting accuracy through a high-rigidity frame with enhanced vibration damping that is less affected by temperature fluctuations, and high-precision positioning and automatic calibration functions via fully closed-axis control. ■ Compatible with various processes Broadly supports processes such as eutectic bonding and resin bonding, and is equipped with monitoring functions after mounting, making process control easy. Options ■ Resin transfer mechanism ■ Multi-chip compatibility ■ N₂ purge mechanism
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Applications/Examples of results
Optical device Optoelectronic device COC implementation COS implementation
Company information
Our company is headquartered in Kanazawa City, Ishikawa Prefecture, and has sales offices and factories both within and outside the prefecture. We focus on the bottling business, which involves filling beverages and other products, and we are expanding into various fields such as solid-liquid mixing and dispersion systems, laser processing machines (including fiber lasers and CO2 lasers), and semiconductor assembly equipment (such as taping machines, multifunctional test handlers, ball mount machines, and bonders). Please feel free to contact us if you have any inquiries.
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