Adhesive for Electrical and Electronic Components [FC Hard]

Reginasu Chemical Co., Ltd. will be exhibiting at the "37th NEPCON Japan" held at Tokyo Big Sight from today, the 25th, to the 27th! We will introduce adhesive and resin formulations that can meet various needs such as high heat resistance, resistance to engineering plastics, and stress relaxation. We have prepared a variety of exhibits so that you can experience our distinctive products firsthand! We would be grateful if you could stop by our exhibition booth when you visit. 【Exhibition Overview】————————————————— 37th NEPCON Japan Date: January 25 (Wednesday) to 27 (Friday), 2023, 10:00 AM to 5:00 PM Venue: Tokyo Big Sight, East Exhibition Hall, Hall 3 Booth Number: 23-18 ——————————————————————- *One invitation ticket is required per person for entry. Please use the invitation ticket below. https://ma.imsys.jp/r/1580531?m=0000&c=00000000 Thank you very much for your attention.

Reginas Kasei Co., Ltd. will be exhibiting at the "37th NEPCON Japan" held at Tokyo Big Sight from January 25 to 27! We will introduce adhesive and resin formulations that can meet various needs such as high heat resistance, resistance to engineering plastics, and stress relaxation. We have prepared a variety of exhibits so that you can experience our distinctive products firsthand! We would be grateful if you could stop by our exhibition booth when you visit. 【Exhibition Overview】————————————————— 37th NEPCON Japan Date: January 25 (Wednesday) to 27 (Friday), 2023, 10:00 AM to 5:00 PM Venue: Tokyo Big Sight, East Exhibition Hall, Hall 3 Booth Number: 23-18 ——————————————————————- *One invitation ticket is required per person for entry. Please use the invitation ticket below. https://ma.imsys.jp/r/1580531?m=0000&c=00000000 Thank you very much for your attention.

Introducing the one-component adhesive 【A-7373BKLC】 with good adhesion to LCP. 【Features】 ■ Excellent adhesion to liquid crystal polymer (LCP). ■ Compatible with low halogen content. 【Representative Properties】 Viscosity (mPa.s): 62,000 Gel Time (seconds): 80 Tensile Shear Adhesive Strength (LCP): 580 (N/cm²) Samples are available upon request. For more details, please download the catalog or feel free to contact us through our website or the Ipros site. ↓↓↓↓ Download the catalog here! ↓↓↓↓ https://www.ipros.jp/catalog/detail/578370?hub=60+4649133

We would like to introduce our flexible one-component adhesive [A-8530BKLC] that can cure at low temperatures and has minimal changes in physical properties when heated. It is suitable for bonding low-heat-resistant components that require stress relaxation. 【Features】 ■ Improved hardness changes during thermal history, which were an issue with conventional flexible epoxy adhesives, achieving a balance between flexibility and reliability during thermal history. ■ Can cure at low temperatures. ■ Low viscosity for excellent workability. ■ Also compliant with low halogen requirements. Samples are available upon request. For more details, please download the catalog or feel free to contact us through our website or the Ipros site. ↓↓↓↓ Download the catalog here! ↓↓↓↓ https://www.ipros.jp/catalog/detail/578374?hub=60+4649133